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Ultrahigh-speed processing platform for high-power laser device

A high-power laser, processing platform technology, applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of fast crystal growth technology not working well, expensive, and low moving speed, and achieves occupational occupation. The effect of small space, low cost and simple production method

Inactive Publication Date: 2011-07-27
NORTHWESTERN POLYTECHNICAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The two-dimensional mobile platform for conventional laser processing, the translational platform or the moving speed of the laser light source are relatively small, so that the rapid crystal growth technology of high-power laser processing cannot be well exerted
The fast processing platform, such as the platform that reaches the speed of several hundred millimeters to meters per second, is relatively expensive.

Method used

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  • Ultrahigh-speed processing platform for high-power laser device
  • Ultrahigh-speed processing platform for high-power laser device
  • Ultrahigh-speed processing platform for high-power laser device

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Experimental program
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Effect test

Embodiment Construction

[0018] Now in conjunction with embodiment, accompanying drawing, the present invention will be further described:

[0019] The invention proposes a set of moving platform suitable for high-power laser processing. When the speed of the moving platform is too small to reach the speed required by the experiment, the experimental instrument can be used as a set.

[0020] In this embodiment, a rotating arm 4 and a processing platform 6 are included; the processing platform 6 and two fixing screws 5 are made of superalloy material higher than 600° C., and the rotating arm 4 is made of soft aluminum material.

[0021] The pivoting arm 4 is in the shape of a long axis, with a width of 30mm and a height of 20mm, and the two ends are designed as semicircular arcs; the length of the guide rail through hole 3 in the center of the pivoting arm 4 is 131.5mm, the width is 7mm, and the two ends are of radius 3.5mm. Semi-arc design; the shaft hole 2 where one end of the rotating arm 4 is conne...

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Abstract

The invention relates to an ultrahigh-speed processing platform for a high-power laser device. The platform is characterized in that: one end of a turning arm (4) is provided with a shaft hole (2) connected with a motor rotor, the center of the turning arm (4) is provided with a guide rail through hole (3), and a processing platform (6) is fixed at any position of the guide rail through hole (3) through two fixing screws (5). The ultrahigh-speed processing platform for the high-power laser device is made into a long shaft shape according to the factors of high speed and limited laboratory available space and has adjustable speed. The platform is not only suitable for common alloy, but also can be used for ultrahigh-speed laser processing of other nonmetallic materials.

Description

technical field [0001] The invention relates to a high-power laser ultra-high-speed processing platform, relates to an ultra-high-speed application process in the laser processing (melting) process, and belongs to the field of laser processing devices. Background technique [0002] Laser processing is a new technology emerging in the early 1960s. Compared with traditional processing technology, laser processing has many advantages: first, non-contact processing, without the influence of mechanical force; second, due to its high energy density, it can process high hardness, high Melting point, extremely brittle difficult-to-process materials; third, high processing precision, small thermal deformation, high processing quality; fourth, combined with modern CNC machine tools, the laser processing has the characteristics of high processing accuracy, good controllability, and simple procedures. . So far, laser processing has been widely used in material processing, such as laser...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/08C23C24/10B23K26/70
Inventor 王楠唐林峰周龙姚文静
Owner NORTHWESTERN POLYTECHNICAL UNIV
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