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High adhesive force dipping-adhesive manufacturing process

A manufacturing process and high adhesion technology, applied in the direction of adhesives, epoxy glue, adhesive types, etc., to achieve the effects of high cross-linking density, good corrosion resistance, and large internal stress

Inactive Publication Date: 2011-08-03
DONGGUAN GUANHUI HARDWARE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At present, there is no resin adhesive specially configured for the above problems.

Method used

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  • High adhesive force dipping-adhesive manufacturing process
  • High adhesive force dipping-adhesive manufacturing process
  • High adhesive force dipping-adhesive manufacturing process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0017] see figure 1 , a high-adhesion epoxy manufacturing process, the manufacturing process includes the following steps:

[0018] (1) The molar ratio configuration of the reaction substances: according to the ratio of different amine values, viscosities and solid contents, the products with different indexes are synthesized;

[0019] (2) Establishment of reaction temperature and reaction time: control the reaction time and temperature according to the index; determine the sufficient reaction of the material chemical infrastructure;

[0020] (3) Establishment of curing temperature: after the reactants have reacted, perform curing treatment to obtain a mixture with a balanced viscosity and solid content;

[0021] (4) Vacuum casting process: Stir the mixture repeatedly and put it into a vacuum box to reduce the air gap and air bubbles in the casting product to obtain the finished product.

[0022] The step (2) also includes the following steps: after the reaction of the react...

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Abstract

The invention discloses a high adhesive force dipping-adhesive manufacturing process which comprises the steps of: synthesizing products with different indexes according to different amine values, viscosities and proportions of materials with different solid contents; controlling reaction time and temperature; determining the chemical infrastructure of materials to be fully reacted; carrying out the curing process so as to obtain a mixture with balanced viscosity and solids after the reactant is reacted; repeatedly stirring and putting the mixture into a vacuum tank; and obtaining finished products after reducing air gaps in a poured product and bubbles. The dipping-adhesive resin has high cross-linking density and big internal stress; as network structures contain a large quantity of hydroxide groups absorbing water easily, the dipping-adhesive resin has the defects of high moisture absorption, bad size stability and dielectric performances, low toughness and bad moist head stability and the like, and phenomena such as adhesive failure, air holes, water waves and the like of products appear in the processing process. By improving the formulation, performances such as heat resistance, moisture absorption, dielectric properties, impact toughness, consolidation and the like are improved. Phenomena such as adhesive failure, air holes, water waves and the like of the produced products are avoided.

Description

technical field [0001] The invention relates to the technical field of chemical manufacturing, in particular to a high-adhesion drip glue manufacturing process. Background technique [0002] Epoxy resin is widely used in coatings, adhesives, electrical and electronic, civil engineering, composite materials and other fields due to its excellent dielectric properties, adhesiveness, solvent resistance, and heat resistance. However, due to its brittleness, it is not strong enough. , Poor weather resistance and so on hinder the expansion of its market. With the rapid development of electronic and electrical materials and composite materials, people have higher and higher requirements for the characteristics of epoxy resin, such as high purity, high heat resistance, high water resistance, high strength and high toughness of epoxy resin. , low stress, high electrical properties, fast curing, low viscosity, high flame retardancy, etc. Moreover, it is the quality goal that epoxy re...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C08G59/00B29C39/42
Inventor 汪卫星
Owner DONGGUAN GUANHUI HARDWARE
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