LED encapsulation structure

Abstract

The invention discloses an LED encapsulation structure, which comprises a pedestal, an LED chip positioned on the pedestal, an optical lens, a phosphor layer positioned on the light emitting surface of the optical lens, and a first optical film layer positioned on the incident light surface of the optical lens, wherein the first optical film layer is of a concave surface shape, and the first optical film layer is formed by alternately coating two materials with different refractive indexes. Because the first optical film layer has high transmission on the blue light emitted by the LED chip and high reflection on yellow light emitted by stimulated radiation of phosphor powder, the utilization rate of the yellow light emitted by the phosphor powder is improved, the total light efficiency of an LED device is improved and the heat absorption is reduced; and in addition, the first optical film layer which is of the concave surface shape and has certain curvature is arranged on the optical lens, and the light emitted by the LED chip is projected on the first optical film layer in small incident angles, so that the total light efficiency of the LED device is improved.

Description

technical field [0001] The invention relates to the field of semiconductor optoelectronic devices, and more specifically relates to an LED packaging structure capable of improving light extraction efficiency. Background technique [0002] Because LED (Light Emitting Diode; Light Emitting Diode) has the advantages of long life, low energy consumption, fast start-up, etc., LED devices have been widely used in signal lamps, automobile lamps, large-screen display and lighting and other fields. At present, the most commonly used white light LED is to obtain white light by combining blue LED chip and phosphor powder. The typical packaging process of white light LED is like this. After the blue light LED chip is bonded, phosphor glue is dotted on the blue light chip and then baked. White light LEDs can be easily obtained by using this packaging method, which is a method widely used in commercial white light LED packaging at present. [0003] This widely used white LED packaging p...

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Problems solved by technology

[0003] This widely used white LED packaging process has the following problems: the phosphor particles in the phosphor colloid will backscatter the blue light emitted by the LED chip; and the stimulated emission of the phosphor itself will generate a large amount of light radiated toward the chip Therefore, there will be a considerable part of the energy of light bouncing back and forth between the phosphor glue, the chip and the reflector, most of which will be absorbed by the chip and the packaging material and converted into heat energy, which will directly lead to the loss of light efficiency and operating temperature of the LED device. the rise of

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