Stiffening plate for printed circuit board

Abstract

The invention discloses a stiffening plate for a printed circuit board, which consists of an ink layer, a polyimide compound membrane and an adhesive layer for sticking the polyimide compound membrane to the printed circuit board. A polyimide compound membrane fixing clamp is arranged between the ink layer and the adhesive layer. The polyimide compound membrane consists of a plurality of polyimide membranes and adhesion agent layers for sticking the adjacent polyimide membranes. The ink layer with specific thickness can lower the warping height of the compound membrane stuck to the circuit board, and contributes to protection of circuit patterns of electronic products. In addition, the ink layer of the stiffing plate comprises developers, wherein white developers can endow the compound membrane with good reflectivity and black developers can improve the shielding effect of circuit patterns, and the ink layer of the stiffing plate also comprises heat radiation powder bodies which can enhance heat radiation.

Description

technical field [0001] The invention relates to a reinforcing board used for printed circuit boards, in particular to a reinforcing board which is not easy to warp and has the effect of shielding circuits. Background technique [0002] Polyimide resin has high thermal stability and excellent insulation, mechanical strength, and chemical corrosion resistance, and is often used in various electronic processing materials. For example, it is used for the insulation layer of flexible printed circuit boards (Flexible Printed Circuit), or further used for electronic components, such as the reinforcement of printed circuit boards. [0003] Polyimide film has been widely used in electronic materials. Among them, the polyimide reinforcement board used in printed circuit boards can generally be divided into single-layer thick boards or composite polyimide reinforcement boards, and composite polyimide reinforcement boards Reinforcing plate of formula, such as the polyimide plate struct...

AI Technical Summary

Problems solved by technology

[0003] Polyimide film has been widely used in electronic materials. Among them, the polyimide reinforcement board used in printed circuit boards can generally be divided into single-layer thick boards or composite polyimide reinforcement boards, and composite polyimide reinforcement boards Reinforcing plate of formula, such as the polyimide plate structure announced by Chinese Taiwan patent I257898, it is a compound type of different thickness formed by 2 mil (mil) polyimide plate and thermosetting adhesive of different thickness Polyimide board, however, the problem encountered in the application of polyimide composite film is that it is limited by the cost of polyimide film and the thickness of the composite film, which cannot cover the circuit layout pattern and is easy to be copied by the industry

In addition, the composite film is a combination of polyimide film and adhesive layer, but the difference in thermal expansion coefficient between the two often leads to warping of the composite film used for reinforcement after it is attached to the flexible circuit board. Phenomenon

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