Deposition process for improving compound quantity of nanoparticles in electric deposition

Abstract

The invention discloses a deposition process for improving the compound quantity of nanoparticles in an electric deposition procedure. A mandrel used as a cathode and a first-phase metal electrode used as an anode are respectively put into a plating solution; the first-phase metal electrode used as a soluble anode is positioned in an annular anode basket; a plurality of through holes are formed at the inner side of the annular anode basket; the first-phase metal electrode is composed of a plurality of first-phase metal cakes; the plurality of first-phase metal cakes are put into the anode basket; a plurality of non-conductive hard particles are placed between the inner side of the anode basket and the mandrel; the diameter of each first-phase metal cake and the diameter of each non-conductive hard particle are greater than the diameter of each through hole; second-phase nanoparticles are mixed in the plating solution; and the mandrel makes a spinning motion. The invention greatly improves the compound quantity of nanoparticles in a compound electroformed layer, and greatly improves the fatigue strength, wear resistance and corrosion resistance of the compound electroformed layer.

Description

technical field [0001] The invention relates to an electrodeposition process, in particular to a deposition process for increasing the composite amount of nano particles in electrodeposition. Background technique [0002] Nano-composite electrodeposition technology uses electrochemical principles to co-deposit insoluble nanoparticles and metal ions to be deposited on the surface of the cathode, thereby obtaining a composite deposition layer with some special properties. Because the composite deposition layer contains nanoparticles with excellent performance, which can significantly improve its wear resistance, friction reduction, high temperature resistance and corrosion resistance, it has broad applications in the fields of machinery, chemical industry, aerospace, automobile and electronics industries. Application prospect. [0003] The higher the composite amount of nanoparticles in the composite deposition layer, the better the uniformity of dispersion, and the better th...

AI Technical Summary

Problems solved by technology

When other process parameters remain unchanged, the nanoparticles in the process of composite co-deposition mainly hit the surface of the cathode (that is, the mandrel) in the plating solution mainly by the centrifugal force generated by mechanical stirring or other means of stirring, so the surface of the cathode The residence time is shorter, and the number of nanoparticles that actually realize composite co-deposition is small, resulting in a small composite amount of nanoparticles and uneven distribution in the composite electrodeposition layer, which ultimately directly affects various properties of the composite deposition layer.

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