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Photosensitive resin composition and method for producing photosensitive resin used therein

A technology of photosensitive resin and manufacturing method, which is applied in the field of photosensitive resin composition, can solve the problems of complicated waste liquid treatment, etc., and achieve the effects of good thermal stability and development management range, excellent performance, and high photosensitivity

Active Publication Date: 2014-01-29
RESONAC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is not preferable to use a chromium compound such as chromium naphthenate as a synthesis catalyst in view of increasing awareness of environmental issues and complicated treatment of waste liquid after development.

Method used

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  • Photosensitive resin composition and method for producing photosensitive resin used therein
  • Photosensitive resin composition and method for producing photosensitive resin used therein
  • Photosensitive resin composition and method for producing photosensitive resin used therein

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0046] Hereinafter, although an Example demonstrates this invention in more detail, this invention is not limited to these Examples.

Synthetic example 1

[0048] Add the ethyl carbitol acetate of 192 mass parts in the flask that has stirrer, gas inlet tube and reflux tube, make the cresol novolac type epoxy resin of 206 mass parts (1 equivalent) Epotohto (registered trademark) YDCN704 manufactured by the company, epoxy equivalent 206) was dissolved therein. Further, 72 parts by mass (1.0 mol) of acrylic acid, 0.23 parts by mass of hydroquinone, 0.4 parts by mass of triphenylphosphine and 2 parts by mass of zirconium naphthenate (metal content is 6 mass %) were added, while The reaction was continued at 130° C. for 10 hours while blowing air into the gas inlet tube at the lower surface, and a reactant (epoxy acrylate) having an acid value of 0.5 mgKOH / g was obtained. Next, 111.03 parts by mass (0.73 mol) of tetrahydrophthalic anhydride was added thereto, and it was made to react at 120 degreeC for 2 more hours, and the reactant whose solid content acid value was 105.3 mgKOH / g was obtained. Then, 22.72 parts by mass (0.16 mol) of...

Synthetic example 2

[0050] Photosensitive resin B was obtained in the same manner as in Synthesis Example 1, except that 2 parts by mass of zirconium octoate (12 mass % of metal content) was used instead of 2 parts by mass of zirconium naphthenate (6 mass % of metal content).

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Abstract

A photosensitive resin composition containing: (A) a photosensitive resin which is obtained by reacting a monoepoxy compound having an unsaturated double bond and a water-soluble monoepoxy compound with a carboxyl group which is produced by reacting a polyfunctional epoxy compound with an unsaturated monobasic acid in the presence of a trivalent organophosphorus compound and at least one of zirconium naphthenate and zirconium octoate and then further reacting the resulting product with a polybasic acid anhydride; (B) an epoxy resin; (C) a photopolymerization initiator; and (D) a reactive diluent.  The photosensitive resin composition is suitable as a highly sensitive solder resist ink which contains no chromium compound and can be developed by ultraviolet exposure and a dilute aqueous alkali solution, while having good thermal stability and control width of development.  A coating film of the solder resist ink has excellent properties.

Description

technical field [0001] The present invention relates to a photosensitive resin composition, more specifically, to a photosensitive resin composition that does not contain chromium compounds, has high photosensitivity to ultraviolet exposure, has good physical properties of the obtained coating film, and can be developed by dilute alkali. permanent resin composition. Background technique [0002] In recent years, dilute alkali developing liquid photosensitive solder resist inks have been widely used in solder resist inks for various printed circuit boards. As the photosensitive resin of the dilute alkali developing type, the acid side chain type epoxy acrylate resin obtained by making the hydroxyl group of an epoxy acrylate resin react with an acid anhydride is known, for example. In the past, chromium naphthenate has been used in the synthesis catalyst of this acid-side-chain type epoxy acrylate resin in order to obtain good thermal stability and development management rang...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08F290/06C08G59/17G03F7/027
CPCC08G59/1461C08F290/064C08L63/10H05K3/287C08G59/685C08F283/105G03F7/0388G03F7/038C08F290/06C08G59/1466G03F7/027
Inventor 上井浩志荻原和重
Owner RESONAC CORPORATION