Photodetector with digital three-dimensional package assembly

Abstract

The invention relates to a photodetector with a digital three-dimensional package assembly. An interconnection structure of six ceramic substrates of the photodetector is characterized in that a method that three-dimensional cabling of the ceramic substrates is combined with a traditional plane bonding technology is adopted, thus the six ceramic substrates, multiple chips and peripheral circuits are assembled in a TO25-13 encapsulation shell; the six ceramic substrates are arranged reasonably so as to stick the chips and the peripheral circuits to the six ceramic substrates; a fifth ceramic substrate is taken as a bridge connection transition substrate; a first to fourth ceramic substrates at four side walls and a sixth ceramic substrate at the top are connected with the fifth ceramic substrate by adopting a traditional wire bonding mode, and the interconnections among the substrates are realized by combining with the method of three-dimensional cabling of the ceramic substrates, thereby ensuring that any two interconnected ceramic substrates are arranged in the same plane, reducing the difficulty of the wire bonding, improving the reliability and the maneuverability and strengthening the antijamming capability. The photodetector is compact in structure, smaller in volume and lighter in weight.

Description

technical field [0001] The invention belongs to the field of microelectronic packaging, and relates to a photodetector with a digital three-dimensional assembly structure design. Background technique [0002] With the rapid development of the microelectronics industry, the role of component packaging in it is becoming more and more important. At present, the trend of device packaging is stronger, smaller and lighter, which requires packaging technology to be multi-functional and high-end. development in the direction of integration. Multi-chip packaging technology is a highly integrated three-dimensional placement technology that emerged on this basis. [0003] Three-dimensional placement technology is widely used in various fields, including the field of detectors, but the detectors are mostly analog devices, which only simply amplify the signal, and the output needs to be controlled and digitally processed. It increases the difficulty of subsequent circuit processing, es...

AI Technical Summary

Problems solved by technology

[0003] Three-dimensional placement technology is widely used in various fields, including the field of detectors, but the detectors are mostly analog devices, which only simply amplify the signal, and the output needs to be controlled and digitally processed. It increases the difficulty of subsequent circuit processing, especially in systems with strict area requirements, which brings great inconvenience

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