High-power base plate effectively integrating circuit board and radiator and manufacturing method thereof

A manufacturing method and circuit board technology, applied in the direction of circuits, electric solid-state devices, semiconductor devices, etc., can solve the problems affecting the quality and life stability of high-power LED street lamps, the heat of LED lamps cannot be exported in time, and thermal obstacles, etc., to achieve The effect of low price, easy purchase and stable performance

Inactive Publication Date: 2011-09-14
周波
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, the heat passes through multiple layers and heat transfer of various media, often causing the heat generated by the LED lamp to be unable to be exported in time, or the he

Method used

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  • High-power base plate effectively integrating circuit board and radiator and manufacturing method thereof
  • High-power base plate effectively integrating circuit board and radiator and manufacturing method thereof
  • High-power base plate effectively integrating circuit board and radiator and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0040] Example 1

[0041] Taking a high-power LED lighting device as an example, the specific structure and manufacturing method of the present invention are compared and described.

[0042] Such as figure 1 As shown, the traditional LED lamp heat dissipation mode is: the electronic component 7 (LED lamp) is connected to the aluminum substrate 8, and the thermal silica gel 9 is coated between the electronic component 7 and the aluminum substrate 8. The aluminum substrate 8 includes soldered copper foil and epoxy resin. Or insulating materials and aluminum alloy sheets. An aluminum alloy heat sink 10 is further installed under the aluminum base plate 8, and a thermal conductive silicone grease 11 is coated between the aluminum base plate 8 and the aluminum alloy heat sink 10.

[0043] Such as figure 2 As shown, the heat dissipation method of the present invention is: the electronic component 7 is directly bonded or welded to the metal heat dissipation plate 1, avoiding the heat diss...

Example Embodiment

[0057] Example 2

[0058] Electronic components 7 are fixed on the electronic component mounting area 4 by insulating ceramic glue 12, and the circuit area is covered with a thermally conductive insulating ceramic circuit layer 2 formed by insulating ceramic glue 12. The thickness of the thermally conductive insulating ceramic circuit layer 2 is between 0.1 and 0.3 mm , The thermally conductive insulating ceramic circuit layer 2 is covered with a copper foil circuit 3, the copper foil circuit 3 is provided with solder joints 5, and the area of ​​the metal heat sink 1 except for the solder joints 5 and the electronic component mounting area 4 is sprayed with waterproof insulation Paint 6.

[0059] The manufacturing method of the high-power substrate with the circuit board and the radiator efficiently integrated is as follows:

[0060] a. The area on the metal heat dissipation plate 1 except for the electronic component installation area 4 is coated with insulating ceramic glue 12 to ...

Example Embodiment

[0067] Example 3

[0068] The manufacturing method of the high-power substrate for the efficient integration of the circuit board and the heat sink can also be:

[0069] a. The insulating ceramic glue 12 is screen-printed on the area of ​​the metal heat sink 1 except for the electronic component mounting area 4 to make a thermally conductive insulating ceramic circuit layer 2. The thickness of the thermally conductive insulating ceramic circuit layer 2 is between 0.1 and 0.3 mm ;

[0070] b. After the insulating ceramic circuit layer 2 is cured at 120-180°C for 5-15 minutes, a layer of solderable conductive copper paste is printed on the thermally conductive insulating ceramic circuit layer 2 through a screen to form a copper foil circuit 3;

[0071] c. For the copper foil circuit 3 formed by the solderable conductive copper paste of screen printing, it is directly cured at 120-180℃ for 10-25min;

[0072] d. Spray tin on each solder joint 5 on the copper foil circuit 3;

[0073] e. Avoi...

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Abstract

The invention discloses a manufacturing method of a high-power base plate effectively integrating a circuit board and a radiator, belongs to the field of electronic printing circuit board and electronic element radiation, and particularly discloses the high-power base plate effectively integrating the circuit board and the metal radiator and having higher radiating performance and the manufacturing method thereof. The structure of the high-power base plate comprises a metal heating panel (1), and is characterized in that: a heat-conducting and insulating ceramic circuit layer (2) is coated on the metal heating panel (1); a copper foil circuit (3) is arranged on the heat-conducting and insulating ceramic circuit layer (2); a welding spot (5) is arranged on the copper foil circuit (3); and waterproof insulating paint (6) is sprayed onto the areas, except the welding spot (5) and an electronic element mounting area (4), on the surface of the metal heating panel (1). Compared with the prior electronic element radiation mode, the high-power base plate is high in heat-radiation efficiency and stable in performance, and has cheap and readily available raw materials. The method is evolved from the traditional mature process and is suitable for mass production.

Description

technical field [0001] A high-power substrate with efficient integration of a circuit board and a radiator and a manufacturing method thereof, which belong to the field of electronic component heat dissipation in the field of electronic printed circuit boards, and specifically relate to a large circuit board and a metal radiator that are efficiently integrated and have better heat dissipation performance power substrate. Background technique [0002] As a new type of lighting source, high-power LED (light-emitting diode) lamps have the advantages of energy saving, environmental protection, long service life, and low consumption. They have been widely used in home lighting, commercial lighting, road lighting, industrial and mining lighting and other fields. At present, power-type white light LEDs can only convert about 15-25% of electrical energy into light energy, and almost all of the remaining energy is converted into heat energy. With the increase of LED power, the heat ...

Claims

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Application Information

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IPC IPC(8): H01L25/075H01L33/48H01L33/64H01L33/00F21V29/00F21Y101/02F21V29/10F21V29/508F21Y115/10
CPCH01L2224/48091H01L2224/48247H01L2924/181H01L2924/00014H01L2924/00012
Inventor 周波
Owner 周波
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