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Piezoelectric stacking type MEMS (Micro-electromechanical System) vibration energy collector and manufacturing method thereof

A technology of vibration energy harvesting and piezoelectric stacking, applied in the manufacture/assembly of piezoelectric/electrostrictive devices, piezoelectric/electrostrictive devices, piezoelectric/electrostrictive/magnetostrictive devices, etc. It can solve the problems of low output power and achieve high output power, wide application prospects, and simple and reliable preparation methods

Inactive Publication Date: 2011-09-14
SHANGHAI JIAO TONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] The present invention aims at the above-mentioned deficiencies existing in the prior art, and provides a piezoelectric stacked MEMS vibration energy harvester and a preparation method thereof, adopting a piezoelectric stacked structure, which greatly improves the energy conversion efficiency of the transducer element and solves the problem of The problem of low output power of the traditional MEMS piezoelectric energy harvester, and its preparation method is given in detail, the preparation method is simple and easy to implement

Method used

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  • Piezoelectric stacking type MEMS (Micro-electromechanical System) vibration energy collector and manufacturing method thereof
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  • Piezoelectric stacking type MEMS (Micro-electromechanical System) vibration energy collector and manufacturing method thereof

Examples

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Embodiment 1

[0033] Such as figure 1 As shown, this embodiment includes: a silicon fixed base 1, a piezoelectric stack 2 and a quality block 3, wherein: one end of the piezoelectric stack 2 is fixed on the silicon fixed base 1 and the other end is suspended and connected to the mass Block 3 is fixedly connected.

[0034] The silicon fixed base 1 is composed of a silicon chip 4 and a silicon dioxide layer 5 disposed on both sides of the silicon chip 4 .

[0035] The piezoelectric stack 2 and the mass block 3 are bonded together by epoxy resin.

[0036] The mass block 3 is a nickel metal block or a tungsten metal block.

[0037] The piezoelectric stack 2 includes: a substrate 6 and a piezoelectric film layer 7 and an electrode layer 8 attached to the substrate 6, wherein: the piezoelectric film layer 7 is two or more layers, and the electrode layer 8 covers the On the upper and lower surfaces of each piezoelectric film layer 7, between the piezoelectric film layer 7 and the electrode laye...

Embodiment 2

[0058] Such as figure 2 As shown, this embodiment includes: a silicon fixed base 1, a piezoelectric stack 2 and a quality block 3, wherein: one end of the piezoelectric stack 2 is fixed on the silicon fixed base 1 and the other end is suspended and connected to the mass Block 3 is fixedly connected.

[0059] The silicon fixed base 1 is composed of a silicon chip 4 and a silicon dioxide layer 5 disposed on both sides of the silicon chip 4 .

[0060] The piezoelectric stack 2 and the mass block 3 are bonded together by epoxy resin.

[0061] The mass block 3 is a nickel metal block or a tungsten metal block.

[0062] The piezoelectric stack 2 includes: a substrate 6 and a piezoelectric film layer 7 and an electrode layer 8 attached to the substrate 6, wherein: the piezoelectric film layer 7 is two or more layers, and the electrode layer 8 covers the On the upper and lower surfaces of each piezoelectric film layer 7, between the piezoelectric film layer 7 and the electrode lay...

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Abstract

The invention relates to a piezoelectric stacking type MEMS (Micro-electromechanical System) vibration energy collector and a manufacturing method thereof. The collector comprises a silicon fixing base, a piezoelectric stacking sheet and a mass block, wherein one end of the piezoelectric stacking sheet is fixed on the silicon fixing base, and the other end of the piezoelectric stacking sheet is fixedly connected with the mass block. By adopting the piezoelectric stacking type structure, the energy conversion efficiency of an energy conversion element is greatly improved, and the problem of the low output power of the traditional MEMS piezoelectric energy collector is solved. The invention also relates to a manufacturing method of the vibration energy collector. The preparation method is simple and easy to realize.

Description

technical field [0001] The invention relates to a device and method in the technical field of micro-electromechanical systems, in particular to a piezoelectric stacked MEMS vibration energy harvester and a preparation method thereof. Background technique [0002] In recent years, with the continuous advancement of wireless communication and MEMS (micro-electromechanical systems) technology, the application range of micro-systems such as micro-electronic devices and micro-sensors has continued to expand. The wireless sensor network is composed of a large number of ubiquitous tiny sensor nodes with communication and computing capabilities, which are composed of wireless communication, and can independently complete specified tasks according to environmental requirements. application prospects. [0003] At present, in the power supply of micro devices such as wireless sensor nodes, the traditional energy supply method is still adopted, that is, the battery is used as the main ...

Claims

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Application Information

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IPC IPC(8): H01L41/113H01L41/22B81B3/00B81C1/00
Inventor 刘景全唐刚李以贵杨春生柳和生
Owner SHANGHAI JIAO TONG UNIV