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Epoxy resin composition

An epoxy resin and epoxy compound technology, applied in electrical components, circuits, electrical solid devices, etc., can solve the problem of high viscosity, and achieve the effects of high operability, excellent stability over time, and excellent long-term storage stability

Inactive Publication Date: 2011-09-21
DAICEL CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the viscosity of the glycidyl-type epoxy compounds listed as commonly available epoxy resins is relatively high

Method used

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  • Epoxy resin composition
  • Epoxy resin composition
  • Epoxy resin composition

Examples

Experimental program
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Effect test

Embodiment 1

[0115] At room temperature, stir and mix the following components in a rotating and rotating mixer to prepare an adhesive composition: 3,4-epoxycyclohexylmethyl-3 as an alicyclic diepoxide compound, 4-epoxycyclohexane carboxylate (manufactured by Daicel Chemical Industry Co., Ltd., CELLOXIDE 2021P, R in general formula (I) 1 ~R 18 =H) 10.0 parts by weight; bisphenol F type epoxy resin (manufactured by Nippon Kayaku Co., Ltd., RE-303L) 10.0 parts by weight; methyl hexahydrophthalic anhydride (manufactured by New Japan Rika Co., Ltd., MH700, Acid anhydride equivalent: about 168) 23.3 parts by weight; imidazole epoxy resin addition curing agent (manufactured by Asahi Kasei E-materials, Novacure HX-3088) as a curing accelerator 1.2 parts by weight; γ-ring as a silane coupling agent 0.4 parts by weight of oxypropoxypropyltrimethoxysilane (manufactured by Tokyo Kasei Co., Ltd.); and silica SC4500-SQ (manufactured by Admatechs Co., Ltd.) as a filler, with an average particle size of 1....

Embodiment 2

[0117] Except for replacing the silica SC4500-SQ as a filler with silica SC4500-SEJ (manufactured by Admatechs Co., Ltd., average particle size 1.0μm, specific surface area 4.0m 2 / g, an adhesive composition was obtained in the same manner as in Example 1 except that the spherical fused silica surface-treated with γ-glycidoxypropyltrimethoxysilane) was 67.4 parts by weight.

Embodiment 3

[0119] In addition to 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane carboxylate (manufactured by Daicel Chemical Industry Co., Ltd., CELLOXIDE 2021P, general formula (I) R in 1 ~R 18 =H) 10.0 parts by weight is replaced with bicyclohexyl-3,3'-diepoxide (R in general formula (II) 21 ~R 38 =H) An adhesive composition was obtained in the same manner as in Example 2 except for 10.0 parts by weight.

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Abstract

The invention aims at providing an epoxy resin composition with low viscosity, high flowability and excellent save stability. The epoxy resin composition comprises an epoxy compound (A), a curing agent (B), a curing accelerator (C), an inorganic filling material (D) and a silane coupling agent (E), wherein the epoxy compound (A) comprises 20-80% of alicyclic diepoxy compound (a1) and 80-20% of epoxy compound (a2) apart from the alicyclic diepoxy compound (a1) by weight; the alicyclic diepoxy compound (a1) is shown by the following general formulas (I or II); and the inorganic filling material (D) is the inorganic particles of which the surfaces are treated through the silane coupling agent.

Description

Technical field [0001] The present invention relates to an epoxy resin composition, and in particular, to an epoxy resin composition suitable for use as a semiconductor resin sealing material, particularly an underfill material in flip chip mounting. Background technique [0002] In recent years, with the spread of small electronic devices such as digital cameras and mobile phones, there is a demand for miniaturization of LSI devices. Based on this, a mounting method called flip-chip mounting has replaced the traditional wire bonding method and has become increasingly popular. The flip-chip mounting is to directly mount a semiconductor chip face down on a circuit board to obtain a mounting area. Minimized method. [0003] In flip-chip mounting, the side where the pads for connecting the chips are formed face down, and the pads for the connection and the electrodes on the surface of the package or printed circuit board (PCB) opposite to it are electrically grounded or grounded thro...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08G59/24C08K13/06C08K9/06H01L23/29
Inventor 孙珠姬水岛隆博
Owner DAICEL CHEM IND LTD
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