Unlock instant, AI-driven research and patent intelligence for your innovation.

Method for generating chip authentication code, and chip authentication method and system

An authentication method and authentication system technology, which is applied in the field of chip authentication in semiconductor manufacturing, can solve the problems of increased production cycle time and cost, and achieve the effect of reducing production cycle time

Inactive Publication Date: 2013-01-23
ALI CORP
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the black box technical solution can only use a single machine for mass production, and cannot use multiple machines for mass production, so the production cycle time (cycle time) increases
In addition, this method also increases the cost of production due to the need for additional verification equipment

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for generating chip authentication code, and chip authentication method and system
  • Method for generating chip authentication code, and chip authentication method and system
  • Method for generating chip authentication code, and chip authentication method and system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] In order to make the above-mentioned and other purposes of the present invention clearer and easier to understand, the preferred embodiments are specifically listed, together with the accompanying drawings, and are described in detail as follows:

[0030] Figure 3A It is a flowchart of a chip authentication method according to an embodiment of the present invention. In this embodiment, the chip authentication method begins with step S30a, wherein a classification test of a plurality of chips is performed to classify the chips according to a predetermined classification standard. In one embodiment, the classification tests include DC tests (such as electrical continuity tests, open (short) circuit current and leakage current tests), and / or digital and analog function tests, but are not limited thereto. In order to allow IC manufacturing companies, IC design companies and customers to continuously track used chips and their functions, the chip authentication method of t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a chip authentication method, comprising the steps of: generating a first unique code of a first chip, wherein the first unique code is formed by combining a first wafer batch number to which the first chip belongs and a first chip coordinate of the first chip on a first wafer; writing the first unique code in the first chip; and performing the chip authentication for the first chip according to the first unique code, wherein when the first unique code written in the first chip accords with the first unique code before writing, the authentication is passed, otherwise,the authentication is not passed. The invention also discloses a chip authentication system and method for generating chip authentication code. The chip authentication system disclosed by the embodiment of the invention can be installed in a plurality of machines for large-scale mass production to decrease the production period time, and can generate safe and unrepeated passwords for chip authentication.

Description

technical field [0001] The invention relates to semiconductor manufacturing, in particular to a chip authentication method for semiconductor manufacturing. Background technique [0002] With the changing demands of customers, the communication between integrated circuit (IC) design (or manufacturing) companies and customers is becoming more and more frequent, and the importance of chip certification is also increasing day by day. Die identification is used to ensure that chips can be correctly and safely transferred between IC design (manufacturing) companies and customers. [0003] Currently, there are various existing technical solutions available for chip authentication. figure 1 It is a flow chart of the existing chip authentication method. Such as figure 1 Shown in steps S10~S17, this existing method is used in the final test (Final Test, FT) stage of the wafer. This method first generates a random random number (random number), and then uses the random number genera...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00H01L21/66
Inventor 林建明
Owner ALI CORP