Improved robot telescopic arm
A telescopic arm and robot technology, which is applied to conveyor objects, transportation and packaging, etc., can solve the problems of reducing the optical detection performance of the optical fiber detection unit, reducing the service life of the robot telescopic arm, and locating the wafer incorrectly by the optical fiber detection unit. The method is simple and easy to implement, the production cost is reduced, and the effect of preventing corrosion
Active Publication Date: 2013-09-04
SEMICON MFG INT (SHANGHAI) CORP +1
View PDF0 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
In addition, when the robot telescopic arm 100 puts the wafer into the etching processing chamber for polysilicon etching processing, or takes out the wafer that has been polysilicon etching processing from the etching processing chamber, the optical fiber transmitting unit 2011 built in the robotic telescopic arm and the optical fiber receiving unit 2012 are directly exposed to the polysilicon etching treatment chamber through the first light transmission hole 1031 and the second light transmission hole 1032, and the residual hydrofluoric acid in the polysilicon etching treatment chamber will corrode the optical fiber transmission unit 2011 and the optical fiber reception unit 2012 , thereby reducing the optical detection performance of the fiber optic detection unit, causing the fiber optic detection unit of the mapping sensor to misposition the wafer, thereby reducing the service life of the robotic telescopic arm
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0021] In the following description, numerous specific details are given in order to provide a more thorough understanding of the present invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without one or more of these details. In other examples, some technical features known in the art are not described in order to avoid confusion with the present invention.
[0022] In the polysilicon etching process of the wafer manufacturing process, it is usually necessary to use a robot to transfer and position the wafer. The invention discloses an improved robot telescopic arm, which protects the optical fiber detection unit from being corroded by hydrobromic acid and other etching residues by adding transparent protective components on the detection surfaces of the front ends of the arms on both sides of the robot telescopic arm. role. image 3 A schematic structural view of the improved robot telescopic arm 100 according to ...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention provides an improved robot telescopic arm. A transparent protective layer is formed on a detection face at the front end of the robot telescopic arm, thus preventing the corroded residues, such as hydrobromic acid and the like from corroding into an optical fiber detection unit of an optical fiber mapping sensor arranged in the robot telescopic arm during the corroding process of polycrystalline silicon. The improved robot telescopic arm provided by the invention is simple and practicable, has an obvious effect, and can be used for effectively protecting the optical fiber detection unit of the optical fiber mapping sensor from being corroded by the corroded residues, such as hydrobromic acid and the like during the corroding process of the polycrystalline silicon; and the improved robot telescopic arm is beneficial to increasing the service life of the robot telescopic arm, and lowering the manufacturing cost of a wafer.
Description
technical field [0001] The present invention relates to an improved robotic telescopic arm for picking up and transferring wafers in a semiconductor chip manufacturing process, and in particular to a robotic telescopic arm that can prevent an optical fiber detection unit of an optical fiber mapping sensor built in the robotic telescopic arm from being corroded by etchant. Background technique [0002] The high-speed automated production of wafers requires efficient, high-precision and high-stability transport and positioning of wafers between the various manufacturing processes of the wafer. The transfer and positioning of such wafers between each process is usually done by a robot (Robot), that is to say, the robot takes out the wafer from the cassette containing the wafer through the robot telescopic arm (Blade) configured on it, And sent to the treatment chamber (Chamber) for corresponding treatment. Then, the processed wafer is taken out from the processing chamber by t...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/677
Inventor 沈祥江
Owner SEMICON MFG INT (SHANGHAI) CORP