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Material for hot stamping mould and preparation method thereof

A technology of hot stamping die and preparation process, applied in the field of hot stamping die material manufacturing process and steel for new hot stamping die, can solve the problem of not being hot stamping

Inactive Publication Date: 2011-10-12
SHANGHAI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Judging from the current production situation, these materials are all selected from the existing mold materials, each has its own advantages and disadvantages, but none of them are the best materials suitable for hot stamping.

Method used

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  • Material for hot stamping mould and preparation method thereof
  • Material for hot stamping mould and preparation method thereof

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Effect test

Embodiment

[0028] A kind of new hot stamping die material of present embodiment, its chemical composition comprises by weight percentage:

[0029] C 0.48%, Si 0.7%,

[0030] Mn 0.67%, Cr 2.6%,

[0031] Mo 2.2%, V 0.95%,

[0032] P<0.013%, S<0.005%,

[0033] Fe balance

[0034] The preparation process is as follows:

[0035] a. Induction smelting: put the ingredients in a medium frequency induction furnace, melt them at a temperature of 1500-1700 ℃, and then pour ingots;

[0036] b. Electroslag remelting: put the steel ingot in the electroslag remelting device for secondary refining, which can reduce the content of inclusions, and obtain a steel ingot with uniform composition, compact structure and good quality. During remelting, the alloy removes inclusions through slag washing and floating in the molten pool, and is further refined, the durability and plasticity of the alloy are improved, and various macroscopic and microscopic defects are eliminated or reduced;

[0037] c. Anneal...

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Abstract

The invention relates to a novel steel product for a hot stamping mould. The novel steel product is applicable to the hot stamping mould having requirements on high abrasive resistance and high cold and heat fatigue resistance and belongs to the technical field of hot stamping mould material manufacture processes. The material provided by the invention for the hot stamping mould comprises the following chemical components in percentage by weight: 0.40-0.50% of C, 0.7-0.9% of Si, 0.65-0.85% of Mn, 0.025% of P, 0.005% of S, 2.5-2.7% of Cr, 2.1-2.4% of Mo, 0.8-1.0% of V, and the balance ofl Fe and micro impurities. After being subjected to inductive smelting, electro-slag re-smelting, annealing, homogenizing at high temperature, forging and annealing, the material has a good machining performance. After being subjected to quenching at 1020 degrees centigrade and tempering at 550 degrees centigrade, the material has the advantages of good hot strength, hot hardness, high abrasive resistance and fatigue resistance, good weldability, higher heat conductivity coefficient and lower thermal expansion coefficient. The material is applicable to the hot stamping forming mould.

Description

technical field [0001] The invention relates to a novel steel material for a hot stamping die, which is suitable for a hot stamping die required for high wear resistance and good cold and heat fatigue resistance, and belongs to the technical field of hot stamping die material manufacturing technology. Background technique [0002] Energy saving, environmental protection, and safety are the general trends in the development of today's automobile technology. Reducing fuel consumption, saving energy, and reducing vehicle emissions are one of the urgent problems to be solved today, and automobile lightweight is an important way to solve this problem. At present, steel companies have launched a series of quenched boron steel series with ultra-high strength, such as 22MnB5 and 30MnB5 launched by the well-known Arcelor company, and Usibor1500 specially produced for auto parts. The characteristics of these quenched boron steels are that after rolling and forming, the material struct...

Claims

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Application Information

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IPC IPC(8): C22C38/24C22B9/18C21D1/26
CPCY02P10/25
Inventor 吴晓春邵严
Owner SHANGHAI UNIV
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