Chemical silvering method for PS (polystyrene) microspheres

A kind of microsphere chemistry and microsphere technology, applied in liquid chemical plating, metal material coating process, coating, etc., can solve the problem of excessive density of conductive fillers, and achieve low density, cost reduction, and high conductivity Effect

Active Publication Date: 2011-10-12
ZHONGBEI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention aims at the existing problem of excessive density of conductive fillers, and provides a method for electroless silver plating of PS microspheres. The method

Method used

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  • Chemical silvering method for PS (polystyrene) microspheres
  • Chemical silvering method for PS (polystyrene) microspheres
  • Chemical silvering method for PS (polystyrene) microspheres

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Take 1g of PS microspheres, add them to the prepared 100ml roughening solution for roughening for 15min (30°C), take them out, and wash them with distilled water for 2-3 times. Then put it into 100ml sensitization solution for 15min (30°C), take it out, and wash it with distilled water 2-3 times. Put into 100ml activation solution to activate for 15min (30℃). Take it out, wash it 2-3 times with distilled water, and set it aside. Take 0.25gAgNO 3 Add to 100ml of distilled water, add 1.5ml of ammonia water (28%) to obtain a transparent silver ammonia solution. Add the treated PS microspheres to the silver-ammonia solution, add 0.5ml formaldehyde (37%) dropwise after stirring, keep stirring for 20min, wash with distilled water for 3 times after filtering, filter, and vacuum dry at 80°C to obtain Ag / PS Composite particles. In this embodiment, each step formula and test result are as follows:

[0025]

Embodiment 2

[0027] Take 2g of PS microspheres and add them to the prepared 30ml roughening solution to roughen for 15min (30°C). After taking them out, wash them with distilled water for 2-3 times. Then put it into 30ml of sensitizing solution for 15min (30°C), take it out, and wash it with distilled water for 2-3 times. Put it into 30ml activation solution to activate for 15min (30℃). Take it out, wash it 2-3 times with distilled water, and set it aside. Take 0.7gAgNO 3 Add to 100ml of distilled water, add 3.8ml of ammonia water (28%) to obtain a transparent silver ammonia solution. Add the treated PS microspheres to the silver-ammonia solution, add 1.8ml formaldehyde (37%) dropwise after stirring, keep stirring for 20min, wash with distilled water for 3 times after filtering, filter, and vacuum dry at 80°C to obtain Ag / PS Composite particles. In this embodiment, each step formula and test result are as follows:

[0028]

Embodiment 3

[0030] Take 2g of PS microspheres and add them to the prepared 100ml roughening solution for roughening for 15min (30°C). After taking them out, wash them with distilled water for 2-3 times. Then put it into 60ml of sensitization solution for 15min (30°C), take it out, and wash it with distilled water 2-3 times. Put it into 35ml activation solution to activate for 15min (30℃). Take it out, wash it 2-3 times with distilled water, and set it aside. Take 1gAgNO 3 , was added to 200ml of distilled water, and 4.5ml of ammonia water (28%) was added to obtain a transparent silver-ammonia solution. Add the treated PS microspheres to the silver-ammonia solution, add 2ml formaldehyde (37%) dropwise after stirring, keep stirring for 20min, wash with distilled water for 3 times after filtering, filter, and vacuum dry at 80°C to obtain the Ag / PS composite particle. In this embodiment, each step formula and test result are as follows:

[0031]

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Abstract

The invention provides a chemical silvering method for PS (polystyrene) microspheres, which comprises the following steps: coarsening the surfaces of PS microspheres; sensitizing and activating the coarsened PS microspheres; adding the treated PS microspheres into a silver-ammonia solution while stirring; adding a certain amount of reducer to finish the chemical surface silvering of the PS microspheres; and filtering, separating, washing, and drying in vacuum to obtain Ag/PS compound particles. The PS silvering method has a simple preparation process and simple composition of raw materials, and is easy to implement large-scale production; and the density of the prepared PS/Ag compound particles is less than 1.2*10<-3>kg.cm<-3>, and the resistivity is less than 4.2*10<-4>ohm.cm, thereby ensuring that the prepared PS/Ag compound particles have light weight and high conductivity.

Description

technical field [0001] The invention relates to an electroless silver plating method, in particular to a method for electroless silver plating on the surface of PS microspheres. Background technique [0002] Conductive rubber has good elasticity, ductility, environmental sealing, medium corrosion resistance, and electromagnetic shielding properties. It can be used in aerospace, ships, computers, and mobile phones to achieve electromagnetic compatibility in which electronic and electrical equipment and the environment are harmonious and coexist. , while avoiding the leakage of important information. Traditional conductive fillers for conductive rubber are generally solid metals with high conductivity or high magnetic permeability, such as copper powder and silver powder. Copper powder has problems such as low conductivity and easy oxidation, while silver powder has problems such as high cost and high density. [0003] Preparation of silver-plated composite particles of cond...

Claims

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Application Information

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IPC IPC(8): C23C18/20C23C18/42
Inventor 赵贵哲陈闯孙友谊周兴刘亚青王毅
Owner ZHONGBEI UNIV
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