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LED (light emitting diode) pixel unit device structure and preparation method thereof

A device structure and pixel unit technology, which is applied in the direction of electrical components, electric solid devices, semiconductor devices, etc., can solve the problems of large distance between LED chip units, different LED tube attenuation curves, and poor color consistency of the display screen, so as to solve the problem of light blocking problems, miniaturization and integration, and the effect of improving color consistency

Inactive Publication Date: 2011-10-12
ENRAYTEK OPTOELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, since the light source of LEDs is composed of different colors, slight changes in the arrangement of LEDs may change the color of the screen or reduce the brightness.
[0007] Moreover, because in the prior art, red (R), green (G), and blue (B) LEDs are generally packaged separately and then arranged together, the package structure is not compact, and the distance between the LED chip units is relatively large.
[0008] Bare chip technology (mainly chip-on-board packaging technology and flip-chip technology) can package RGB three-color LEDs together and improve the resolution of the display screen by reducing the device packaging area, but this technology can improve The degree of resolution of the
[0009] In addition, although LED display screens should generally be able to ensure color consistency at the initial stage of use, however, with the attenuation of LED tubes during use, individual differences in RGB semiconductor devices, and differences in LED production processes, there will be As a result, the attenuation curve of each LED tube is different, resulting in worsening color consistency of the display screen as the usage time increases

Method used

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  • LED (light emitting diode) pixel unit device structure and preparation method thereof
  • LED (light emitting diode) pixel unit device structure and preparation method thereof
  • LED (light emitting diode) pixel unit device structure and preparation method thereof

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Embodiment Construction

[0049]The structure of the LED pixel unit device proposed by the present invention and its preparation method will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. Advantages and features of the present invention will be apparent from the following description and claims. It should be noted that all the drawings are in very simplified form and use imprecise ratios, which are only used for the purpose of conveniently and clearly assisting in describing the embodiments of the present invention.

[0050] The core idea of ​​the present invention is to provide a LED pixel unit device structure, and package three LED chip units that are connected by the same substrate but completely isolated electrically in a flip-chip structure, thereby reducing the device packaging area and improving The resolution of the LED display screen is improved; and the structures of the three LED chip units are exactly the same. By forming R, G, ...

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Abstract

The invention discloses an LED (light emitting diode) pixel unit device structure. In the structure, three LED chip units which are connected by a same substrate but electrically separated are used and are packaged in a face-down mode to reduce the packaging area of the device, thus the resolution ratio of an LED display screen can be improved; and each LED chip unit has the very same structure, an R color filter film, a G color filter film and a B color filter film are respectively formed on each LED chip unit for sending out a red light, a green light and a blue light respectively, thus each LED chip unit can have an uniform attenuation and the color consistency of the display screen can be improved. The invention also discloses a preparation method for the structure. The LED modules are arranged on a heat conducting substrate in the face-down mode, thus the procedures of chip die bond and gold wire bonding can be omitted, the manufacturing costs can be reduced, the production efficiency can be improved, the problem of light-blocking of the pad and the lead in small-sized LED packaging can be solved, the light extraction efficiency of the LED can be considerably improved, the packaging space can be saved and the further miniaturization and integration of the LED packaging size can be realized.

Description

technical field [0001] The invention relates to the technical field of LED preparation, in particular to an LED pixel unit device structure and a preparation method thereof. Background technique [0002] A light-emitting diode (LED, Light Emitting Diode) is a semiconductor solid-state light-emitting device, which uses a semiconductor PN junction as a light-emitting material, and can directly convert electricity into light. When a forward voltage is applied to both ends of the semiconductor PN junction, the minority carriers injected into the PN junction recombine with the majority carriers, and excess energy is released to cause photon emission, which directly emits red (R) and orange colors. , yellow, green (G), cyan, blue (B), purple light. [0003] With the gradual maturity of ultra-high brightness LED technology, the price continues to drop, and because of its use of three primary colors, good color reproduction, low power consumption, and long life, short and thin, and...

Claims

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Application Information

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IPC IPC(8): H01L25/075H01L33/48H01L33/62H01L33/50H01L33/00
CPCH01L2224/16225
Inventor 程蒙召肖德元张汝京
Owner ENRAYTEK OPTOELECTRONICS
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