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High-precision jacquard glass fiber fabric

A technology of glass fiber cloth and glass fiber, which is applied in the field of printed circuit board manufacturing. It can solve the problems of uneven surface and easy warping of the glass fiber cloth base material, and achieve high working temperature, low dielectric constant, and high frequency. high effect

Inactive Publication Date: 2011-10-19
BEIJING UNION UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the defects of the printed circuit board in the prior art, the technical problem to be solved by the present invention is the problem that the surface of the glass fiber cloth base material in the prior art is uneven and easy to warp, and a kind of electronic component insertion surface is flat and not easy to be warped. Warped printed circuit board fabrication method

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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  • High-precision jacquard glass fiber fabric

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] Jacquard weaving: select glass fibers with a diameter of 0.009-0.05mm, and weave them into such figure 1 In the circuit area shown, since the width of the jacquard machine is usually about 190 to 350 cm, multiple pieces such as figure 1 The same circuit area shown to meet the demands of modern mass production, figure 1 The central circuit area is the area that is preset to form a circuit. In this embodiment, only warp 1 can be seen on the front of the fabric, that is, only warp 1 or weft 2 is on the side carrying electronic components when the printed circuit board is finally formed. The rest of the area other than the central area is the surrounding transition area, where the warp 1 and weft 2 are normally interwoven to form a plain weave, thereby forming a firm weave structure.

[0017] Pre-cutting: Cut according to the jacquard shape forming the central circuit area, and retain some surrounding transition areas to ensure that the cut glass fiber cloth can maintain t...

Embodiment 2

[0024] Compared with Example 1, the difference is that the central circuit area has several interweaving areas of warp yarn 1 and weft yarn 2 when the jacquard machine is weaving. This interweaving area can be designed according to the needs of circuit wiring, which not only can ensure The structure of the circuit area is stable, and it can also be used for drilling holes in the final circuit board.

[0025] Other steps are with embodiment 1.

[0026] In addition, this embodiment 2 only shows the case where the central region has several dot-shaped interleaving regions. In fact, continuous interweaving regions can be designed according to the needs of circuit wiring, so that the shape of the non-interleaving region is consistent with the final circuit shape to be formed. Correspondingly, by designing high-precision glass fiber cloth in this way, even if the glass fiber shrinks or stretches during processing, the amount of shrinkage or stretching is basically the same in the en...

Embodiment 3

[0028] Compared with Examples 1 and 2, the difference is that the surface of the Jacquard woven base fabric has multiple different circuit areas, that is, different circuit shapes can be designed on the continuously woven glass fiber cloth according to the different quantities required by customers.

[0029] Other steps are with embodiment 1 and 2.

[0030] By arranging different circuit areas in the width direction, some requirements for permitting small batches can be met, and at the same time, the overall weaving cost can be reduced.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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Abstract

The invention provides a manufacturing method of high-precision jacquard glass fiber fabric. The method comprises the following steps of: weaving a substrate of the high-precision jacquard glass fiber fabric by a jacquard technology; pre-cutting the substrate, soaking the substrate in an adhesive, and drying; after cooling, precisely cutting according to an actual circuit; and performing surface treatment on the substrate, electroplating and etching to obtain the high-precision printed circuit board provided by the invention. The high-precision printed circuit board can meet the requirements on miniaturization, high precision, large batch and high efficiency production and has wide market prospect.

Description

technical field [0001] The present invention relates to a method for manufacturing a printed circuit board, and more particularly relates to a method for manufacturing a printed circuit board with jacquard glass fiber cloth as a base material, which can be applied to high-density, high-precision electronic component installation. Background technique [0002] In recent years, with the continuous development of electronic products towards miniaturization, thinning, light weight, and high performance, the printed circuit boards need to be installed with more electronic components in a smaller area while the size is getting smaller. , and in the current large-scale production methods, for the sake of production efficiency, the method of automatically inserting electronic components on the assembly line is generally used. For such automatic insertion technology, it is required that the electronic components inserted each time can be accurately positioned on the printed circuit b...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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Application Information

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IPC IPC(8): H05K3/00D06M15/41D06M15/55D06M11/79
Inventor 方新赵林惠李军
Owner BEIJING UNION UNIVERSITY
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