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Manufacturing method of composite enhanced insulating section bar

A manufacturing method and composite technology, applied in sustainable waste treatment, solid waste management, climate sustainability, etc., can solve the problems of waste of resources and environment, no low cost, low value, etc., to avoid environmental pollution and cheap raw materials , the effect of strong load-bearing capacity

Active Publication Date: 2011-11-02
AEROSPACE KAITIAN ENVIRONMENTAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, these polyurethane plastics are usually discarded, landfilled or incinerated due to their low value, causing waste of resources and environmental pollution, and there is currently no low-cost solution

Method used

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  • Manufacturing method of composite enhanced insulating section bar
  • Manufacturing method of composite enhanced insulating section bar

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] see figure 1 Prepare waste circuit board resin powder with a mass fraction of 65% in the particle size range of 2 to 5 mm, a mass fraction of 25% polyurethane powder in the particle size range of 1 to 20 mm and a mass percentage of 10% in the particle size range of 1 to 10 mm The sawdust powder is fully mixed in the mixer, and the stearic acid accounting for 5% of the weight of the mixed material is added for blending modification; the modified mixed non-metallic material is fully mixed with the cement powder according to the mass percentage of 80%, and added A proper amount of water is stirred and mixed to form a slurry; the slurry is injected into the test mold and cast into shape; the test mold injected with the slurry is placed on a vibrator to vibrate for 5 minutes to remove air bubbles and accelerate the hydrothermal synthesis reaction of the gelling material; Scrape the surface of the slurry with a scraper; demould after 24 hours, and obtain a composite reinforce...

Embodiment 2

[0041] see figure 1 Prepare waste circuit board resin powder with a mass fraction of 85% in the particle size range of 0.5-2mm, a mass fraction of 10% polyurethane powder in the particle size range of 1-10mm and a mass percentage of 5% in the particle size range of 1-5mm fully mix the straw powder in a mixer, add titanate accounting for 3% of the weight of the mixed material for blending modification; fully mix the modified mixed non-metallic material with cement powder at a mass percentage of 70%, and add an appropriate amount of The water is stirred and mixed to form a slurry; the slurry is injected into the test mold and cast into shape; the test mold injected with the slurry is placed on a vibrator to vibrate for 3 minutes to remove air bubbles and accelerate the hydrothermal synthesis reaction of the gelling material; use a scraper Scrape the surface of the slurry; release the mold after 24 hours, and obtain a composite reinforced profile after drying.

Embodiment 3

[0043] seefigure 1 Prepare waste circuit board resin powder with a mass fraction of 60% in the particle size range of 0.5-2mm, a mass fraction of 30% polyurethane powder in the particle size range of 1-10mm and a mass percentage of 10% in the particle size range of 1-5mm The peanut shell powder is fully mixed in a mixer, and the stearic acid accounting for 1% of the weight of the mixed material is added to carry out blending modification; the modified mixed non-metallic material is fully mixed with cement powder according to 65% by mass, and added A proper amount of water is stirred and mixed to form a slurry; the slurry is injected into the test mold and cast into shape; the test mold injected with the slurry is placed on a vibrator to vibrate for 1 min to remove air bubbles and accelerate the hydrothermal synthesis reaction of the gelling material; Scrape the surface of the slurry with a scraper; demould after 24 hours, and obtain a composite reinforced profile after drying. ...

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Abstract

The invention discloses a manufacturing method of a composite enhanced insulating section bar. According to the invention, with a modification technology and a room temperature solidification technology, waste circuit board resin powder, waste polyurethane powder and biomass powder are solidified into a section bar under room temperature. Specific steps of the method are that: after a sieving process, waste circuit board resin powder with a granularity range of 0.5 to 5mm, waste polyurethane powder with a granularity range of 1 to 20 mm, and biomass powder with a granularity range of 1 to 10mm are blended-modified, and cemented; the slurry is injected into a testing mold, and is shaped; the testing mold with injected slurry is placed on a vibrating machine to be vibrated for 1 to 5min, such that air bubbles are removed, and a hydro-thermal synthesizing reaction of the gel material is accelerated; the material is then processed through a surface treatment process that the surface of the slurry is flattened; the slurry is stood for 24 hours, and is demolded; the resulting material is dried, such that the composite enhanced section bar is obtained. According to the invention, no pollution is brought to the manufacturing processes. The technology is simple; the cost is low; the produced section bars have great application value; and low-carbon, environment protection and resource re-utilization are realized.

Description

technical field [0001] The invention relates to a method for manufacturing a composite reinforced thermal insulation profile, in particular to a method for manufacturing a composite reinforced thermal insulation profile with waste circuit board resin powder, waste polyurethane powder and biomass powder. Background technique [0002] With the rapid development of the economy and the electronic information industry, the replacement of electronic and electrical products is increasing, resulting in the formation of a large amount of electronic waste. Discarded circuit boards are an important part of electronic waste. Recycling them can not only save resources but also avoid environmental pollution caused by them. Metal is the most important economic driving force in the waste circuit board recycling industry. Researchers also focus on the recovery of valuable metals in waste circuit boards, often ignoring the recycling and reuse of resin powder. At present, waste circuit board ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B28/00C04B18/20
CPCY02W30/91
Inventor 周益辉
Owner AEROSPACE KAITIAN ENVIRONMENTAL TECH CO LTD
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