Solar silicon wafer cutting mortar

Abstract

The invention relates to solar silicon wafer cutting mortar prepared by the use of specially modified wet silicon carbide sand aggregate. With polyethylene glycol as a carrier, the wet silicon carbide sand aggregate is composed of an auxiliary agent, an auxiliary process carrier and silicon carbide sand aggregate. Different from the traditional silicon carbide (dry sand) usage mode, the usage mode of wet silicon carbide sand has no dust pollution and accords with the production concept of green environmental protection; the cutting mortar is prepared by the use of the wet silicon carbide sandaggregate so as to ensure a more stable product quality, higher rate of fine variety and lower cutting mortar comprehensive cost; the preparation time of the cutting mortar is shortened to one third,resulting in a lower operation cost; with excellent redispersion capability and good mortar wire cladding performance, the slicing efficiency of a wire cutting machine can be greatly improved.

Description

technical field [0001] The invention relates to a mortar used for wire cutting of silicon wafers, in particular to a solar silicon wafer cutting mortar. Background technique [0002] my country's photovoltaic power generation industry has developed rapidly in recent years. Solar silicon wafer cutting equipment has been put into operation several times and dozens of times in the past three years. Among them, the demand for silicon carbide for cutting has reached about 800-900 tons per day. [0003] In the process of wire cutting of solar silicon wafers, the whole mechanism is to use the hard characteristics and sharp water chestnut of silicon carbide particles to gradually cut silicon rods into pieces, so the main characteristics of cutting mortar should have good fluidity, and silicon carbide particles can be used in cutting mortar Uniform and stable dispersion in the system, evenly covering the surface of the high-speed moving steel wire, evenly and steadily making the si...

AI Technical Summary

Problems solved by technology

The main problem is that there are many unstable factors in the quality of cutting sand and cutting fluid. The small amount of artificial mortar each time results in many batches, and human factors have a great influence

[0005] With market demand and price competition, how to reduce the cost of slicing and increase the utilization of renewable resources has become the main means for enterprises to reduce costs. A large proportion of recycled recycled liquid and sand has made it more difficult for enterprises to manage production and quality control. The increase will directly affect the cutting ability of the slicing machine, instability and equipment efficiency decline, product quality cannot be controlled, resulting in increased slicing costs and other shortcomings. The decline in costs in future market competition will affect the development of the entire industry. All are making unremitting efforts to improve the quality of silicon wafers and reduce cutting costs

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