Method for packing alkali metal simple substance
An encapsulation method and alkali metal technology, which are applied in metal material coating process, decorative arts, microstructure devices, etc., can solve problems such as device errors and implementation difficulties, and achieve a low-cost, easy-to-integrate solution that reduces the content of atomic impurities. Effect
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[0073] The specific implementation method of the alkali metal elemental microencapsulation method described in this patent is as follows:
[0074] (1) Select n type Silicon wafers, silicon wafers, and silicon-based wax seal forming molds (including bottom mold, top mold, and male mold) are processed. The bottom mold is a silicon-based double-step structure, and the top mold is a silicon-based double The stepped structure can also be a silicon-based single stepped structure, and the male mold is a high and low stepped structure with a microneedle array;
[0075] (2) Select paraffin wax as the alkali metal packaging material, and its main physical properties are: white particles; melting point: 58°C to 62°C; boiling point: 322°C; density: 0.880g / cm3 to 0.915g / cm3. Melt the paraffin, coat the bottom mold with paraffin, so that the paraffin fills the step groove;
[0076] (3) Machining a whole row of blind holes on the paraffin layer corresponding to the deep steps of the bottom mold, ...
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