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Silver-based cadmium-free medium-temperature solder and preparation method thereof

A medium-temperature, silver-based technology, which is applied in manufacturing tools, welding equipment, metal processing equipment, etc., can solve the problems of high cost and high melting temperature of silver-based solder, and achieve avoiding health hazards, reducing pollution, and good plasticity and toughness Effect

Inactive Publication Date: 2011-11-23
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention solves the problems of high cost and high melting temperature of cadmium-free silver-based solder produced in the prior art, and provides a silver-based cadmium-free medium-temperature solder and a preparation method thereof

Method used

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  • Silver-based cadmium-free medium-temperature solder and preparation method thereof
  • Silver-based cadmium-free medium-temperature solder and preparation method thereof
  • Silver-based cadmium-free medium-temperature solder and preparation method thereof

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specific Embodiment approach 1

[0008] Embodiment 1: This embodiment provides a silver-based cadmium-free medium-temperature solder with low preparation cost and low melting temperature. The silver-based cadmium-free medium-temperature solder is composed of 49-52 parts of silver and 14-16 parts of electrolytic Copper, 2-3 parts of indium, 8-12 parts of tin, 8-13 parts of zinc, 1.0-2.0 parts of copper-phosphorus alloy, 1.0-1.5 parts of manganese, 0.2-0.7 parts of zirconium and 5.05-10.8 parts of rare earth lanthanum wrapped in copper foil The mass fraction of phosphorus in the copper-phosphorus alloy is 14%; the rare earth lanthanum wrapped by copper foil is made of 5.0-10.0 parts of copper foil and 0.05-0.8 parts of rare earth lanthanum by weight.

[0009] The melting temperature of the silver-based cadmium-free medium-temperature solder prepared in this embodiment is 605-660° C., which is equivalent to that of the cadmium-containing solder.

[0010] The silver-based cadmium-free medium-temperature solder pr...

specific Embodiment approach 2

[0014] Specific embodiment two: the difference between this embodiment and specific embodiment one is: the silver-based cadmium-free medium-temperature solder consists of 51 parts of silver, 14.5 parts of electrolytic copper, 2.2 parts of indium, 11 parts of tin, 12 parts of zinc, 1.5 parts of copper-phosphorus alloy, 1.2 parts of manganese, 0.4 parts of zirconium and 6.2 parts of rare earth lanthanum wrapped in copper foil; wherein the mass fraction of phosphorus in the copper-phosphorus alloy is 14%; the rare earth lanthanum wrapped in copper foil The parts by weight are made of 6 parts of copper foil and 0.2 part of rare earth lanthanum. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0015] Specific embodiment three: the silver-based cadmium-free medium-temperature solder described in specific embodiment one is prepared according to the following steps:

[0016] 1. Melting and mixing: ①Put 0.2-0.7 parts of zirconium, 1.0-1.5 parts of manganese and 14-16 parts of electrolytic copper into the medium graphite crucible by weight, and put them into the medium frequency induction heating furnace together with the graphite crucible. Raise the temperature of the induction heating furnace from room temperature to 650-800°C, then add a covering agent on the surface of the heated zirconium-manganese-copper mixture, continue to heat up to 1000-1150°C, and continue heating at 1000-1150°C until the zirconium-manganese-copper mixture is completely melted ; 2. Add 1.0 to 2.0 parts of copper-phosphorus alloy, 8 to 12 parts of tin and 8 to 13 parts of zinc to the molten zirconium, manganese and copper mixture in step 1 at 1000 to 1150 ° C, and continue heating at 1000 to 115...

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Abstract

The invention provides silver-based cadmium-free medium-temperature solder and a preparation method thereof and relates to medium-temperature solder and a preparation method thereof. The invention aims to solve the problems of high cost and high melting temperature of silver-based cadmium-free solder produced in the prior art. The silver-based cadmium-free medium-temperature solder is prepared from the following components in part by weight: 49 to 52 parts of silver, 14 to 16 parts of electrolytic copper, 2 to 3 parts of indium, 8 to 12 parts of stannum, 8 to 13 parts of zinc, 1.0 to 2.0 parts of copper phosphorus alloy, 1.0 to 1.5 parts of manganese, 0.2 to 0.7 part of zirconium and 5.05 to 10.8 parts of copper foil wrapped rare earth lanthanum. The preparation method particularly comprises the following steps of: 1, melting and mixing; 2, casting; and 3, extruding. The silver-based cadmium-free medium-temperature solder and the preparation method thereof have the advantages that: 1,the preparation cost is low and the prepared silver-based cadmium-free medium-temperature solder is low in temperature; 2, cadmium is not contained, so damage to a human body and environmental pollution are reduced; and 3, the plastic toughness is high, so a welding wire and a welding ring with the diameter of 0.5 to 2.0 can be prepared. The method is mainly used for preparing the silver-based cadmium-free medium-temperature solder.

Description

technical field [0001] The invention relates to medium-temperature solder and its preparation method Background technique [0002] Over the past 30 years, with the vigorous development of industries such as electronic information industry, home appliances, automobiles, military industry and building decoration materials, the demand for brazing materials has increased, and brazing technology has played an important role in these emerging industries . It is embodied in that a large amount of silver solder is consumed every year in the manufacture of household appliances and the processing of building materials. Because silver is expensive, silver-based solder containing cadmium is often used. Silver-based solder containing cadmium can not only reduce the liquidus of the alloy, narrow the melting temperature range, and improve the brazing process, but also can braze copper and copper alloys. It can also braze steel, stainless steel and dissimilar metals, and the brazed joints...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/30B23K35/40
Inventor 李卓然张相龙刘羽吴广东何国锐冯吉才
Owner HARBIN INST OF TECH
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