Device and method for dynamically measuring thermal physical parameters of film

Abstract

The invention relates to a device for dynamically measuring thermal physical parameters of a film. The main body of the device provided by the invention comprises a heat source, a heat wave signal source, one-dimensional heat conductors, a data acquisition device, a data processing device, a heat insulating material and a heat radiating fin, wherein each one-dimensional heat conductor comprises two cylindrical sticks which are completely identical; a sample to be measured is sandwiched between the two one-dimensional heat conductors; the heat insulating material integrally wraps the one-dimensional heat conductors and the sample to be measured, thereby reducing heat exchange between the conductor sticks and the outside to the greatest extent; the two ends of the two one-dimensional heat conductors, which are not in contact with the sample to be measured, are respectively connected with two thermoelectric modules; and the other ends of the two thermoelectric modules are respectively connected with the heat radiating fin. By the adoption of the method for dynamically measuring the thermal physical parameters of the film provided by the invention, the thermal conductivity coefficients and thermal diffusion coefficients of different sample films can be calculated. The invention has the advantages that measuring equipment has small size, cost is low and measuring repeatability is high; the longitudinal thermal diffusion coefficients and thermal conductivity coefficients of a film material can be measured directly, errors cused by a contact surface can be overcome.

Description

technical field [0001] The invention belongs to the technical field of thermophysical property measurement, and in particular relates to a device and method for dynamically measuring thermophysical parameters of a thin film, which can simultaneously measure the thermal conductivity and thermal diffusivity of the thin film material in a direction perpendicular to the thin film plane. Background technique [0002] With the wide application of thin film materials in the fields of industry and scientific research, the measurement of various thermophysical properties of thin film materials has become particularly important. The thermophysical properties of materials mainly include thermal conductivity, thermal diffusivity, specific heat, thermal expansion coefficient, material thermal radiation reflectivity, etc. Among them, thermal conductivity and diffusivity are very important parameters, which respectively characterize the ability of an object to transmit heat and the ability...

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Problems solved by technology

This method requires that the distance between the two measurement points should be greater than the propagation wavelength of the thermal wave, and the round rod must have a certain length, so it is not suitable for the measurement of the thermal diffusivity of the film

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