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Insulating board with layered structure and preparation method for insulating board

A layered structure and insulating board technology, which is applied in the direction of insulators, insulators, inorganic insulators, etc., can solve the problems that insulating boards are difficult to achieve in terms of electrical properties, heat resistance, moisture resistance, corrosion resistance, stability, machinability, and environmental protection. , to achieve the effects of excellent comprehensive technical performance, low processing cost, good mechanical strength and dimensional stability

Active Publication Date: 2011-11-23
SHANGHAI GUOJI ELECTRONICS MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The technical problem to be solved by the present invention is to overcome the difficulty in realizing electrical properties, heat resistance, moisture resistance, corrosion resistance, stability, machinability, environmental protection and other performances of various insulating boards in the prior art to meet the needs of use at the same time. defects, providing an insulating board with a layered structure with excellent overall performance and low cost

Method used

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  • Insulating board with layered structure and preparation method for insulating board
  • Insulating board with layered structure and preparation method for insulating board
  • Insulating board with layered structure and preparation method for insulating board

Examples

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Embodiment 1

[0044] 1. Insulation board structure: such as figure 1 As shown, an insulating board of the present invention includes an upper layer 1, a core material 2 and a lower layer 3 which are stacked in sequence and adhered to each other.

[0045] The core material 2 is composed of two layers of glass fiber non-woven fabric layers 21 and a layer of glass fiber cloth layer 22 sandwiched and bonded between them. The material of each glass fiber non-woven fabric layer 21 is a glass fiber non-woven fabric prepreg. The material of the glass fiber cloth layer 22 is a glass fiber cloth prepreg.

[0046] Specific as figure 1 In the shown embodiment, the thickness of the insulating plate can reach 0.5mm-1.6mm.

[0047] Second, the insulation board preparation method:

[0048] In step 1, the glass fiber cloth and the glass fiber non-woven fabric are respectively immersed in the resin glue, taken out, baked, and then cooled to obtain a glass fiber cloth prepreg and a glass fiber non-woven f...

Embodiment 2

[0054] Insulation board structure: such as figure 2 As shown, an insulating board of the present invention includes an upper layer 1, a core material 2 and a lower layer 3 which are stacked in sequence and adhered to each other.

[0055] The core material 2 is composed of two layers of glass fiber cloth layers 22 and a layer of glass fiber non-woven cloth layer 21 sandwiched and bonded between them. Wherein the material of the glass fiber non-woven fabric layer 21 is a glass fiber non-woven fabric prepreg. The material of each glass fiber cloth layer 22 is a glass fiber cloth prepreg.

[0056] Specific as figure 2 In the illustrated embodiment, the thickness of the obtained insulating plate can reach a thickness of 1.5 mm to 1.6 mm.

[0057] Insulation board preparation method:

[0058] Step 1: Put the glass fiber cloth and the glass fiber non-woven fabric into the glue solution for dipping, take out and bake, and then cool to obtain the glass fiber cloth prepreg and the...

Embodiment 3

[0064] Insulation board structure: such as image 3 As shown, an insulating board of the present invention includes an upper layer 1, a core material 2 and a lower layer 3 which are stacked in sequence and adhered to each other.

[0065] The core material 2 is composed of two layers of glass fiber cloth layers 22 and a layer of glass fiber non-woven cloth layer 21 sandwiched and bonded between them. Wherein the glass fiber non-woven fabric layer 21 is made of two glass fiber non-woven fabric prepregs. The material of each glass fiber cloth layer 22 is a glass fiber cloth prepreg.

[0066] Specific as image 3 In the illustrated embodiment, the thickness of the obtained insulating plate can reach a thickness of 1.5 mm to 1.6 mm.

[0067] Insulation board preparation method:

[0068] Step 1: Put the glass fiber cloth and the glass fiber non-woven fabric into the glue solution for dipping, take out and bake, and then cool to obtain the glass fiber cloth prepreg and the glass ...

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Abstract

The invention provides an insulating board with a layered structure. The insulating board comprises an upper surface layer, a core material and a lower surface layer which are sequentially overlaid and mutually adhered, wherein the core material comprises at least one glass fiber non-woven fabric layer and at least one glass fiber cloth layer; the total number of the glass fiber non-woven fabric layers and the glass fiber cloth layers is more than 3; every two glass fiber non-woven fabric layers and / or glass fiber cloth layers are mutually overlaid and adhered; the upper surface layer and the lower surface layer are the glass fiber cloth layers; in the core material, materials of the glass fiber cloth layers comprise more than one glass fiber cloth prepreg which is overlaid, and materials of the glass fiber non-woven fabric layers comprise more than one glass fiber non-woven fabric prepreg which is overlaid; and the upper surface layer and the lower surface layer are made of the glass fiber cloth prepreg. The insulating board has excellent comprehensive performance, a simple preparation process, low pollution to the environment and low cost.

Description

technical field [0001] The invention relates to an insulating board with a layered structure and a preparation method thereof. Background technique [0002] With the rapid development of science and technology, electronic products continue to develop in the direction of miniaturization, light weight, high reliability, and high density. People have put forward higher requirements for the safe use and reliability of electronic products. The performance, quality and service life of electronic products depend to a large extent on the quality of insulating materials used. As the safety guarantee of electronic products, insulating materials can only improve the voltage level of electronic products, increase the load capacity, Only by reducing the size of the product can it ensure long-term safe use under high temperature, high humidity, high load, and harsh conditions. At present, the research and development of various insulating materials with excellent performance and environm...

Claims

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Application Information

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IPC IPC(8): H01B17/60H01B19/00H01B3/08
Inventor 韩涛胡瑞平
Owner SHANGHAI GUOJI ELECTRONICS MATERIALS CO LTD