Positive temperature coefficient material and thermistor containing the material
A technology of positive temperature coefficient and content, applied in the direction of resistors with positive temperature coefficient, etc., can solve the problems of poor stability, low internal resistance, large internal resistance, etc., and achieve good stability, high PTC strength, and internal resistance low effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
preparation example Construction
[0022] The preparation method of the positive temperature coefficient thermistor provided by the present invention includes heating and melting the mixture containing resin, conductive filler, non-conductive filler and auxiliary agent, and then extruding the obtained melt into granules. Since this method is commonly used in the art Compared with the prior art, the method differs only in the raw materials used. Therefore, the preparation method of the positive temperature coefficient material will not be repeated here.
[0023] The present invention also provides a positive temperature coefficient thermistor, which includes a first electrical conductor, a positive temperature coefficient material and a second conductive conductor that are sequentially attached to the first conductive substrate, wherein the positive temperature coefficient material is The positive temperature coefficient material provided by the invention.
[0024] Wherein, the conductive substrate can be a conv...
Embodiment 1
[0033] This embodiment is used to illustrate the positive temperature coefficient material provided by the present invention and the positive temperature coefficient thermistor using the positive temperature coefficient material.
[0034] The nickel-clad copper powder that accounts for 47.5% by weight of the positive temperature coefficient material, the nickel-clad silver powder (average particle diameter is 10nm) of 2.5% by weight, the low-density polyethylene (density 0.920 g / cm) of 46.953% by weight 3 , melting point 120°C, weight average molecular weight 200,000) and 0.047% by weight of DBS, 0.5% by weight of magnesium hydroxide (average particle size is 2 μm) and aluminum hydroxide (average particle size is 4 μm) mixture (magnesium hydroxide and The weight ratio of aluminum hydroxide is 1: 2), the stearic acid of 0.5% by weight and the titanate coupling agent of 2% by weight are mixed at room temperature (25° C.) in a high mixer, first at 800 rpm The mixture was stirred ...
Embodiment 2
[0039] This embodiment is used to illustrate the positive temperature coefficient material provided by the present invention and the positive temperature coefficient thermistor using the positive temperature coefficient material.
[0040] The nickel-coated copper powder (average particle diameter is 50nm), the nickel-coated silver powder (average particle diameter is 100nm) of 1.4 weight %, the high-density polyethylene (density 0.950 gram) of 26.865 weight % of the positive temperature coefficient material / cm 3 , a melting point of 132 ° C, a weight average molecular weight of 200,000) and 0.135% by weight of DBS, 0.5% by weight of magnesium hydroxide (average particle size of 2 μm) and aluminum hydroxide (average particle size of 3 μm) mixture (magnesium hydroxide and The weight ratio of aluminum hydroxide is 1: 1), the stearic acid of 0.5% by weight and the titanate coupling agent of 2% by weight are mixed at room temperature (25° C.) in a high mixer, first at 800 rpm The...
PUM
Property | Measurement | Unit |
---|---|---|
particle size | aaaaa | aaaaa |
particle size | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com