Coupling heat transfer method of array jet and boiling cooling under high heat flux

A high heat flux density, array jet technology, applied in the direction of cooling/ventilation/heating transformation, etc., can solve the problems that cannot meet the heat dissipation requirements of high-power electronic devices, a large amount of coolant flow, large heat transfer, etc., to achieve small temperature rise, Effect of reduced flow rate and high heat exchange capacity

Active Publication Date: 2011-12-07
NANJING UNIV OF SCI & TECH
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Problems solved by technology

However, under the condition of high heat flux density, the required amount of heat exchange is extremely large, and relying on single-phase heat exchange to remove heat will inevitably require a large amount of coolant flow
Comparative literature 1 (B.P.Whelan, A.J.Robinson, Nozzle geometry effects in liquid jet array impingement, Applied Thermal Engineering 29(2009) 2211-2221) st

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  • Coupling heat transfer method of array jet and boiling cooling under high heat flux
  • Coupling heat transfer method of array jet and boiling cooling under high heat flux
  • Coupling heat transfer method of array jet and boiling cooling under high heat flux

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[0011] combine figure 1 , the coupling heat exchange method of array jet and boiling cooling under the condition of high heat flux of the present invention realizes the thermal control ability of array jet cooling and boiling heat exchange, including the selection of cooling liquid, the optimization of single-phase array jet cooling and the control of heat dissipation conditions, Combining single-phase array jet impingement cooling and boiling heat transfer, using the latent heat of evaporation of the cooling liquid to remove the heat of the electronic device, that is, selecting a cooling liquid suitable for the use of the electronic device, and controlling the boiling point of the cooling liquid at -20°C-30°C, such as Freon series and fluorocarbons, etc., can obtain the boiling point temperature within the required range by controlling the temperature and pressure of the cooling liquid, such as by controlling the pressure of the working fluid at -0.5bar-10bar, so that the cool...

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Abstract

The invention discloses a coupling heat exchange method of array jet flow and boiling cooling under the condition of high heat flux, which combines single-phase array jet impact cooling and boiling heat exchange, and uses the latent heat of evaporation of cooling liquid to remove the heat of electronic devices, that is, selects the boiling point For the coolant at -20°C-30°C, by controlling the pressure of the working fluid at -0.5bar-10bar, the boiling point temperature in the required range is obtained, and the coolant is pumped to the array jet impact device, and the jet flow through the jet hole is in heat exchange On the surface, the temperature and pressure of the cooling liquid are controlled at the same time, so that the cooling liquid partially undergoes a phase change after the jet heat exchange, and the latent heat of vaporization of the cooling liquid is used to dissipate heat. The entire array jet flow, boiling cooling coupled heat transfer process. The invention realizes the heat dissipation of the electronic device under the condition of high heat flux density, thereby meeting the heat dissipation requirement of the electronic device under the condition of high heat flux density, effectively controlling the temperature of the electronic device, and meeting the working temperature requirement of the electronic device.

Description

technical field [0001] The invention belongs to the heat dissipation technology of electronic devices, in particular to a heat exchange method coupled with array jet flow and boiling cooling under the condition of high heat flux density. Background technique [0002] The principle of jet impingement cooling is: the fluid is directly sprayed to the surface to be cooled through a nozzle of a certain shape (circular or slit shape). Due to the short flow and high flow velocity, a large pressure is formed on the jet surface, so that the jet impacts the stagnation point. The boundary layer near the cooling zone becomes very thin, so it has extremely high heat transfer efficiency. Compared with conventional convective heat transfer technology, the impact heat transfer coefficient of jet cooling technology is several times or even an order of magnitude higher. [0003] Although single-phase array jet heat transfer has a high convective heat transfer coefficient, it has great advanta...

Claims

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Application Information

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IPC IPC(8): H05K7/20
Inventor 宣益民李强铁鹏
Owner NANJING UNIV OF SCI & TECH
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