Coupling heat transfer method of array jet and boiling cooling under high heat flux

Abstract

The invention discloses a coupling heat exchange method of array jet flow and boiling cooling under the condition of high heat flux, which combines single-phase array jet impact cooling and boiling heat exchange, and uses the latent heat of evaporation of cooling liquid to remove the heat of electronic devices, that is, selects the boiling point For the coolant at -20°C-30°C, by controlling the pressure of the working fluid at -0.5bar-10bar, the boiling point temperature in the required range is obtained, and the coolant is pumped to the array jet impact device, and the jet flow through the jet hole is in heat exchange On the surface, the temperature and pressure of the cooling liquid are controlled at the same time, so that the cooling liquid partially undergoes a phase change after the jet heat exchange, and the latent heat of vaporization of the cooling liquid is used to dissipate heat. The entire array jet flow, boiling cooling coupled heat transfer process. The invention realizes the heat dissipation of the electronic device under the condition of high heat flux density, thereby meeting the heat dissipation requirement of the electronic device under the condition of high heat flux density, effectively controlling the temperature of the electronic device, and meeting the working temperature requirement of the electronic device.

Description

technical field [0001] The invention belongs to the heat dissipation technology of electronic devices, in particular to a heat exchange method coupled with array jet flow and boiling cooling under the condition of high heat flux density. Background technique [0002] The principle of jet impingement cooling is: the fluid is directly sprayed to the surface to be cooled through a nozzle of a certain shape (circular or slit shape). Due to the short flow and high flow velocity, a large pressure is formed on the jet surface, so that the jet impacts the stagnation point. The boundary layer near the cooling zone becomes very thin, so it has extremely high heat transfer efficiency. Compared with conventional convective heat transfer technology, the impact heat transfer coefficient of jet cooling technology is several times or even an order of magnitude higher. [0003] Although single-phase array jet heat transfer has a high convective heat transfer coefficient, it has great advanta...

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Problems solved by technology

However, under the condition of high heat flux density, the required amount of heat exchange is extremely large, and relying on single-phase heat exchange to remove heat will inevitably require a large amount of coolant flow

Comparative literature 1 (B.P.Whelan, A.J.Robinson, Nozzle geometry effects in liquid jet array impingement, Applied Thermal Engineering 29(2009) 2211-2221) studied the impact jet effect of different shapes of jet holes, and the heat transfer surface is a circle with a diameter of 31.5mm surface, the coolant flow range used in the experiment is The heat flux density of the heat exchange surface is only 25.66W / cm 2 , cannot meet the heat dissipation requirements of high-power electronic devices, and the experimental flow is too large

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