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Light-emitting diode lamp and method for manufacturing the radiator of the same

A technology of light-emitting diodes and radiators, which is applied to cooling/heating devices, light sources, electric light sources, etc. of lighting devices, which can solve the problems of reduced heat dissipation efficiency of radiators, reduce thermal resistance, improve heat dissipation efficiency and heat dissipation stability Effect

Inactive Publication Date: 2011-12-14
FOXSEMICON INTEGRATED TECHNOLOGY (SHANGHAI) INC +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is inevitably a structural gap between the circuit board and the ceramic heat sink, which brings about the problem of reduced heat dissipation efficiency of the heat sink

Method used

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  • Light-emitting diode lamp and method for manufacturing the radiator of the same
  • Light-emitting diode lamp and method for manufacturing the radiator of the same
  • Light-emitting diode lamp and method for manufacturing the radiator of the same

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Experimental program
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Embodiment Construction

[0013] see figure 1 and figure 2 , the LED lamp according to an embodiment of the present invention includes a heat sink 20 and a plurality of LED elements 30 .

[0014] The radiator 20 is integrally made of high thermal conductivity and electrical insulation material, such as ceramic material. Preferably, the ceramic material is selected from alumina, silica, titania, zirconia, yttrium oxide, calcium phosphate, silicon nitride, aluminum nitride, titanium nitride, boron nitride, graphite and tungsten carbide Any one or a combination of several of them. The heat sink 20 includes a base plate 22 , an elongated barrel 24 protruding downward from the bottom of the base plate 22 , and a plurality of cooling fins 26 extending outward from the periphery of the barrel 24 . The middle part of the top surface of the substrate 22 further protrudes vertically upwards to form a cylindrical mounting portion 220 for the LED element 30 to be mounted thereon. Several circuits 100 are form...

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PUM

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Abstract

A light-emitting diode lamp, comprising a heat sink and at least one light-emitting diode element pasted on the heat sink, the heat sink is made of ceramic material, the heat sink has a surface for pasting the light-emitting diode element, and the surface A circuit electrically connected to the light emitting diode element is directly formed on it. Compared with the prior art, the light-emitting diode lamp of the present invention can greatly reduce the heat between the light-emitting diode element and the heat sink made of ceramic material by directly forming a circuit on one surface of the heat sink and electrically connecting the light-emitting diode element. Resistance, effectively improving the heat dissipation efficiency and heat dissipation stability of LED lamps. In addition, the present invention also includes a method for manufacturing a radiator of an LED lamp, comprising the following steps: (1) printing a layer of non-metallic material on the first surface of the substrate of the ceramic radiator; Calcining; (3) forming a circuit on the non-metallic material layer by electroplating, sputtering or evaporation.

Description

technical field [0001] The invention relates to a lighting device, in particular to a light-emitting diode lamp and a method for manufacturing a heat sink of the light-emitting diode lamp. Background technique [0002] Light-emitting diode (LED) components have the advantages of small size, high efficiency, mercury-free and long life, so they can replace existing fluorescent lamps or incandescent lamps, reducing energy consumption and carbon dioxide emissions. However, the LED elements will generate a lot of heat during operation, and usually the LED elements in the LED lamps are arranged on a heat sink to ensure their normal operation. [0003] The material for manufacturing the heat sink can be metal, or other heat-conducting materials, such as ceramic materials. However, if ceramic materials are used to manufacture the heat sink, due to the insulating properties of the ceramic material, in order to form the electrical connection between the light emitting diodes, it is n...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21S2/00F21V29/00F21V17/00F21V23/00F21Y101/02F21V29/70
Inventor 吕英杰江国丰黄正杰罗国萌卢建廷陈昱树
Owner FOXSEMICON INTEGRATED TECHNOLOGY (SHANGHAI) INC