Black halogen-free flame-retardant epoxy resin composition and cover film prepared from same

A halogen epoxy resin and epoxy resin technology, applied in the field of cover films for flexible printed circuit boards, can solve problems such as cost and efficiency improvement, production and operation troubles, etc., and achieve good mechanical properties, high peel strength, and excellent size. The effect of stability

Inactive Publication Date: 2012-01-04
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For mass production, the first way only needs to replace the raw materials, and the operation is simple; the second way needs to start from the formula, and it brings some troubles to the production operation; the third way not only needs the adhesive for ordinary cover film , and to develop another black composite layer, the cost and efficiency will increase
Although the first method is good, there is a problem. Black PI films with a thickness of more than 25 μm are sold at home and abroad, while the price of 12.5 μm is relatively expensive, and customers often need black cover films of 12.5 μm PI films, so they have to adopt the second technology. way

Method used

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  • Black halogen-free flame-retardant epoxy resin composition and cover film prepared from same
  • Black halogen-free flame-retardant epoxy resin composition and cover film prepared from same
  • Black halogen-free flame-retardant epoxy resin composition and cover film prepared from same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061] Epoxy resin (product model NC-3000-H, epoxy equivalent 290 g / eq, manufactured by Nippon Kayaku) 29.3 parts by weight; nitrile rubber (product model Nipol 1072CG, acrylonitrile content 27% by mass, manufactured by Zeon Corporation) 17.5 parts by weight parts; 7.6 parts by weight of acrylate-modified epoxy resin (product model BPF307, elastomer content 20% by mass, manufactured by Nippon Shokubai Co., Ltd.); 5.53 parts by weight of diaminodiphenylsulfone (4,4'-DDS); 1- Cyanoethyl-2-ethyl-4-methylimidazole (2E4MZ-CN) 0.136 parts by weight; carbon black (product model HI-Black 50L, manufactured by KCB, Korea) 1.6 parts by weight; aniline black (product model SUPER BLACK NO. 2. 21.8 parts by weight, manufactured by Tokyo Color Industry Co., Ltd., Japan; 10.9 parts by weight of phosphorus-containing flame retardant (product model OP-935, manufactured by Clariant, Germany); 2.2 parts by weight of dispersant (product model BYK 163, manufactured by BYK) share. The solid content...

Embodiment 2

[0062] Example 2: The solid content of the standard formula is calculated by 100 parts by weight, and the addition ratio of other components is the same except for carbon black and aniline black. 4.0 parts of carbon black and 30.0 parts of aniline black were added.

Embodiment 3

[0063] Example 3: The solid content of the standard formula is calculated by 100 parts by weight, and the addition ratio of other components is the same except for carbon black and aniline black. 4.0 parts of carbon black and 20.0 parts of aniline black were added.

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PUM

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Abstract

The invention relates to a black halogen-free flame-retardant epoxy resin composition and a cover film prepared from the same. The black halogen-free flame-retardant epoxy resin composition comprises halogen-free epoxy resin, nitrile rubber, acrylate modified epoxy resin, an amine curing agent, a curing accelerator, carbon black, aniline black, a phosphonium flame retardant, a filler, a dispersing agent, and an organic solvent. The cover film prepared from the composition comprises a polyimide insulating film, a black halogen-free flame-retardant epoxy resin composition layer coated on the polyimide insulating film, and release paper coated on the black halogen-free flame-retardant epoxy resin composition layer. The black halogen-free flame-retardant epoxy resin composition does not contain halogen, the carbon black and the aniline black are adopted to fulfill the aims of black and shading, and a resin system has flame retardancy and keeps better mechanical properties. The cover film has the surface resistivity and volume resistivity reaching standards, the flame retardancy of UL94 V-0 grade, high peeling strength, and excellent dimensional stability, flexibility and processability.

Description

technical field [0001] The invention relates to a halogen-free resin composition, in particular to a black halogen-free flame-retardant epoxy resin composition and a cover film for a flexible printed circuit board prepared by using the same. Background technique [0002] Recently, the market demand for black cover film is getting stronger and stronger. Compared with ordinary cover film, it is opaque and non-reflective. It is mainly used for the preparation of LED light panels, car lights, etc. The film can enhance the contrast of the light source and help improve the working efficiency of optoelectronic components; in addition, the black cover film is also widely used in the manufacture of mobile phones. As far as the preparation technology of black cover film is concerned, there are three ways: one is to coat ordinary cover film with glue on black PI film; / 0142191), the third is to coat a black composite material layer on the core layer, and coat the other side of the cor...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L9/02C08L63/10C08K13/02C08K3/04C09J163/00C09J109/02C09J163/10C09J11/04C09J7/02
Inventor刘生鹏
OwnerGUANGDONG SHENGYI SCI TECH