Back plate system

Abstract

The invention discloses a back plate system which comprises an electrical back plate body, a plurality of single plates and active parallel optical cables, wherein each single plate is provided with one or more high speed electric connectors used for adapting the active parallel optical cables, the electrical back plate body comprises one or more high speed signal connection opening areas used for extension of the high speed electric connectors, and the high speed electric connectors on two adjacent single plates are connected through the active parallel optical cables. Through the back plate system, exchange bandwidth of a traditional back plate is increased.

Description

technical field [0001] The present invention relates to the communication field, in particular to a backplane system. Background technique [0002] With the popularization of smartphone terminals and the emergence of emerging technologies such as cloud computing, Internet services have an increasing demand for bandwidth. However, the current port access bandwidth and backplane switching bandwidth of communication devices at the core nodes of the Internet topology are gradually increasing. Therefore, communication equipment (for example, high-end routers) urgently need to update and upgrade the backplane bandwidth to adapt to the new Internet business expansion requirements. [0003] At present, there are two mainstream technologies for improving the bandwidth of communication equipment backplanes: the first type is on traditional electric backplanes ( figure 1 A schematic diagram of the principle of a traditional electric backplane is shown) to increase the number of high-s...

AI Technical Summary

Problems solved by technology

[0008] a. Increasing the number of high-speed links will bring the following problems: (1), increasing the number of high-speed links on the backplane of the same size will increase the number of layers of the high-speed link backplane, which will increase The processing difficulty of the large backplane leads to an increase in production cost and potential electromagnetic compatibility problems; (2), increasing the number of high-speed links will bring about an increase in power consumption, which will have a great impact on the heat dissipation capability of the system and the packaging technology of the chip. big test

[0009] b. Improving the transmission rate of the high-speed link on the backplane will bring the following problems: there are some essential shackles (such as loss, crosstalk, reflection and parasitic effects, etc.) that prevent the high-speed link from reaching a higher rate. The active signal compensation technology of the external chip is used to improve the signal integrity problem, which will also increase the power consumption of the system. Moreover, even if the active signal compensation technology is used to compensate the signal, the compensation effect is still limited. It will also limit the upper limit that the high-speed link can achieve

This method does not need to embed the optical waveguide on the backplane by setting the optical waveguide channel, but it still needs to embed the optical waveguide on the front and rear boards that form the opposi...

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