High-strength halogen-free epoxy molding compound, and preparation method thereof

An epoxy molding compound, high-strength technology, applied in the field of reinforced epoxy molding compound and its preparation, can solve the problems of not fully satisfying special products, low tracking index, large molding shrinkage, etc., and achieve high and low temperature resistance Good impact, low molding shrinkage, and excellent electrical properties

Active Publication Date: 2012-01-18
WUXI CHUANGDA ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the disadvantages of the current enhanced epoxy molding compound are: high brittleness of the material, high molding shrinkage, and low tracking index (CTI) of the material, which cannot fully meet the requirements of special products; With the improvement of the concept, the original bromine-antimony flame retardant system is gradually restricted in use

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] A method for preparing a high-strength halogen-free epoxy molding compound, the high-strength halogen-free epoxy molding compound is produced through the following steps:

[0030] (1) Grinding: Grinding the resin material to less than 20 mesh, and crushing the auxiliary agent to less than 200 mesh;

[0031] (2) Mixing: 100 parts of modified epoxy resin, 0 parts of epoxy resin, 40 parts of novolak resin, 120 parts of glass fiber, 25 parts of synthetic fiber, 140 parts of silicon dioxide and 100 parts of aluminum hydroxide for each component , after measuring 15 parts of additives, carry out powder mixing;

[0032] (3) Melt mixing: the mixed material is fed into the screw type mixing equipment at a certain feeding speed, and melted and mixed continuously, the mixing temperature is 70~105°C;

[0033] (4) Cooling and pulverization: after cooling, use a pulverizer to pulverize;

[0034] (5) Packaging: directly crushed to a particle size below 2cm for finished product packa...

Embodiment 2

[0038] A method for preparing high-strength halogen-free epoxy molding compound, which is prepared through the following steps:

[0039] (1) Grinding: Grinding the resin material to less than 20 mesh, and crushing the auxiliary agent to less than 200 mesh;

[0040] (2) Mixing: 100 parts of modified epoxy resin, 10 parts of epoxy resin, 40 parts of novolac resin, 145 parts of glass fiber, 20 parts of synthetic fiber, 150 parts of silicon dioxide and 100 parts of magnesium hydroxide for each component , after measuring 15 parts of additives, carry out powder mixing;

[0041] (3) Melt mixing: the mixed material is fed into the screw type mixing equipment at a certain feeding speed, and melted and mixed continuously, the mixing temperature is 70~105°C;

[0042] (4) Cooling and pulverization: after cooling, use a pulverizer to pulverize;

[0043] (5) Packaging: directly crushed to a particle size below 2cm for finished product packaging; or crushed to a particle size below 0.5mm,...

Embodiment 3

[0047] A method for preparing high-strength halogen-free epoxy molding compound, which is prepared through the following steps:

[0048] (1) Grinding: Grinding the resin material to less than 20 mesh, and crushing the auxiliary agent to less than 200 mesh;

[0049] (2) Mixing: 100 parts of modified epoxy resin, 10 parts of epoxy resin, 40 parts of novolac resin, 120 parts of glass fiber, 35 parts of synthetic fiber, 130 parts of silicon dioxide and 50 parts of aluminum hydroxide for each component , 50 parts of magnesium hydroxide, and 15 parts of additives are measured and mixed for powder;

[0050] (3) Melt mixing: the mixed material is fed into the screw type mixing equipment at a certain feeding speed, and melted and mixed continuously, the mixing temperature is 70~105°C;

[0051] (4) Cooling and pulverization: after cooling, use a pulverizer to pulverize;

[0052] (5) Packaging: directly crushed to a particle size below 2cm for finished product packaging; or crushed to ...

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Abstract

The invention discloses a high-strength halogen-free epoxy molding compound, and a preparation method thereof. The molding compound comprises raw materials of: 100 parts of modified epoxy resin, 0 to 100 parts of epoxy resin, 20 to 100 parts of a curing agent, 140 to 250 parts of a strengthening material, 100 to 250 parts of a filling material, 100 to 250 parts of a fire retardant and CTI modifier, and 10 to 50 parts of an auxiliary agent. The preparation method comprises steps that: the materials are well mixed, crushed, mixed, fused and mixed, cooled and crushed, and packaged. The preparation method of the modified epoxy resin comprises steps that: 100 parts of epoxy resin and 5 to 20 parts of liquid rubber are mixed for 4 to 6 hours under a temperature of 100 DEG C to 130 DEG C, the product is cooled, and the product is crushed to a size below 20 meshes. The invention is advantages in that: with the high-strength halogen-free epoxy molding compound prepared by the invention, the produced product has high mechanical strength, small molding shrinkage, good high / low temperature impact resistance, excellent electrical property under bad surroundings, and environment friendliness.

Description

technical field [0001] The invention relates to a reinforced epoxy molding compound and a preparation method thereof, in particular to a high-strength halogen-free epoxy molding compound used in the packaging and molding of automotive electrical appliances and wet electromagnetic coils and a preparation method thereof. Background technique [0002] Among the current packaging and molding materials for automotive electrical appliances and wet electromagnetic coils, reinforced epoxy molding compounds are widely used. Reinforced epoxy molding compound is a special variety of epoxy molding compound. It not only has the moisture resistance and excellent electrical properties of general epoxy molding compound, but also has high mechanical strength. Therefore, reinforced epoxy molding compound is widely used in many fields. There are irreplaceable uses. [0003] However, the disadvantages of the current enhanced epoxy molding compound are: high brittleness of the material, high mo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L63/02C08L83/04C08L13/00C08L21/00C08L61/06C08K13/04C08K3/36C08K3/22C08K7/14
Inventor 陈火保
Owner WUXI CHUANGDA ELECTRONICS
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