Nanometer modifying apparatus of metal material surface

Abstract

The invention discloses a nanometer modifying apparatus of metal material surfaces. The apparatus comprises a frame and a working platform horizontally arranged above the frame. A Y-direction feeding system used for controlling the working platform to move along the Y direction and an X-direction feeding system used for controlling the working platform to move along the X direction are arranged between the frame and the working platform. The working platform is provided with grooves. Fixtures used for fixing a metal material on the working platform are installed on the working platform through the grooves. A rubbing mechanism used for rubbing the metal material is arranged above the working platform. A load system which is fixedly connected with the rubbing mechanism and is used for applying pressures to the rubbing mechanism is arranged on the frame at a place above the working platform. The apparatus provided by the invention is advantaged in simple structure, reasonable design, andhigh practicability. The apparatus can be used for processing planar metal materials with relatively large dimensions, and is not restricted in a laboratory scale. When processed by using the apparatus, the surface of the metal material is smooth, the roughness of the surface is small, and a surface nanometer layer is uniform.

Description

technical field [0001] The invention belongs to the technical field of metal material surface treatment, and in particular relates to a metal material surface nanometerization device. Background technique [0002] Nanostructured materials refer to single-phase or multi-phase nanomaterials whose crystal domains or other characteristic lengths typically have dimensions less than 100 nm. The structural particularity of nanostructured materials makes them have many incomparable excellent properties of traditional coarse-grained and amorphous materials, such as high strength, high diffusion coefficient, high wear resistance, good electrical, magnetic and other properties. There are still difficulties in preparing bulk nanostructured materials. It is prepared by nanocrystalline powder sintering method, and the crystal grains are easy to grow or the density is low during the sintering process. Using severe plastic deformation methods, such as equal channel extrusion (ECAP), high ...

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Problems solved by technology

[0004] Chinese invention patent, authorized announcement number CN1099467C, discloses a surface mechanical grinding treatment (SMAT) technology to realize the surface nanometerization method of metal materials, but at present, this processing technology requires vacuum conditions, the cost is high, and it can only process small It is very difficult to scale up the sample and equipment, and continuous and large-scale production cannot be realized, and the surface roughness of the obtained samples is relatively large, and there is a serious problem of noise pollution

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