Ni-cu alloy target material used in cu electrode protection film and laminated film

An electrode protective film, alloy target technology, applied in metal material coating process, metal layered products, coatings and other directions, can solve the problems of low magnetic permeability of target material, no one has proposed Cu electrode protective film, etc., to achieve effective sputtering effects of radiation, suppression of deterioration of electrical properties, and improvement of adhesion

Active Publication Date: 2012-01-18
DAIDO STEEL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0027] In addition, in order to effectively perform sputtering, the magnetic permeability of the target is required to be low
However, until now, no one has proposed an example of a Cu electrode protective film target that satisfies all of these conditions at the same time, and a laminated film produced using such a target.

Method used

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  • Ni-cu alloy target material used in cu electrode protection film and laminated film
  • Ni-cu alloy target material used in cu electrode protection film and laminated film
  • Ni-cu alloy target material used in cu electrode protection film and laminated film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0143] [1. Preparation of sample]

[0144] A Ni-Cu-Cr alloy target with a predetermined composition is prepared by a dissolution casting method. The Cu content is set to 10 to 60% by mass. The Cr content is set to 0 to 11% by mass. In addition, a Ni-35mass%Cu-1.5mass%Cr-1.5mass%Ti alloy target was prepared by a dissolution casting method. Further, pure Cu and ITO were used for comparison.

[0145] [2. Test method]

[0146] [2.1. Potential difference]

[0147] The standard potentials of Ni-Cu-Cr alloy, Ni-Cu-Cr-Ti alloy, Cu and ITO were measured respectively. Using a carbon electrode as a counter electrode and a calomel electrode as a reference electrode, the standard potential was measured using a potentiostat method in a 200 g / L ammonium sulfate aqueous solution maintained at 40°C.

[0148] Using the obtained standard potential of each material, calculate the potential difference ΔV (V) between Ni-Cu-Cr alloy or Ni-Cu-Cr-Ti alloy and Cu, and the potential difference bet...

Embodiment 2

[0202] [1. Preparation of sample]

[0203] A Ni-Cu-Ti alloy target with a predetermined composition is prepared by a dissolution casting method. The Cu content is set to 10 to 60% by mass. The Ti content is set to 0 to 7% by mass. In addition, as a comparison, pure Cu and ITO were used.

[0204] [2. Test method]

[0205] According to the same procedure as Example 1, the potential difference ΔV between Ni-Cu-Ti alloy and Cu, the potential difference ΔV between Ni-Cu-Ti alloy and ITO, the potential difference ΔV between Ni-Cu-Ti alloy and Cu, The etch rate difference, the stripping rate, and the maximum magnetic permeability μ.

[0206] [3. Results]

[0207] [3.1. Potential difference △V]

[0208] Figure 9 The potential difference ΔV between Ni-Cu-Ti alloy and ITO is shown in . Figure 9 , the dotted line indicates the potential difference ΔV (0.16 V) between Mo-10Nb and ITO used as the protective film of the A1 series wiring material in the prior art.

[0209] Figur...

Embodiment 3

[0248] [1. Preparation of sample]

[0249] Using the target prepared in Example 1 or 2, a laminated film for a touch panel was prepared. That is, a barrier layer, an electrode layer, and a cover layer are sequentially formed (from bottom to top) on the surface of the substrate by sputtering. As the substrate, an ITO / underlayer film / PET substrate or an ITO / underlayer film / glass substrate (both commercially available) was used. A NiCu alloy containing a predetermined amount of Cu or Ti was used for the barrier layer and the cover layer, respectively, and Cu(5N) was used for the electrode layer.

[0250] For comparison, a laminated film was prepared in which Mo-10Nb alloy was used in the barrier layer and the cover layer, respectively, and Al-3Nd was used in the electrode layer.

[0251] Table 1 shows the film-forming conditions of the laminated film for touch panels.

[0252] Table 1

[0253] material

the power

the gas

sputtering rate

film thickness ...

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Abstract

The invention aims to provide a Ni-Cu alloy target material used in a Cu electrode protection film and a laminated film manufactured by using the target material, wherein, the target material can be used as a protection film of the Cu electrode, can restrain an electrical characteristic degradation caused by the electrolytic corrosion or atomic diffusion of the Cu electrode, can form patterns in a higher precision via a wet etching method, can form a protection film having good attachment performance on a transparent electrode and can carry out sputtering effectively. The invention relates to the Ni-Cu alloy target material used in the Cu electrode protection film and the laminated film manufactured by using the target material, the target material comprises, by mass, 15%<=Cu<=55%, and 0.5%<=Cr, Ti<=10.0%, with the balance being Ni and unavoidable impurities.

Description

technical field [0001] The present invention relates to a NiCu alloy target for a Cu electrode protective film and a laminated film. Specifically, the present invention relates to a NiCu alloy target for a Cu electrode protective film for forming a Cu electrode protective film used as an electrode of a touch panel or a liquid crystal panel. material, and a laminated film manufactured using the target material. Background technique [0002] Liquid crystal panels used in touch panels and thin large-screen televisions have a structure in which liquid crystal is sealed between two transparent substrates. A transparent electrode serving as a working electrode of the liquid crystal is formed inside the transparent substrate (one surface on the liquid crystal side). In the transparent electrode, indium tin oxide (ITO) is generally used. In addition, metal electrodes or metal wirings (hereinafter collectively referred to as “metal electrodes”) as external output terminals are form...

Claims

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Application Information

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IPC IPC(8): C22C19/05C22C19/03C22C9/06
CPCB32B15/01C22C19/058C23C14/3414
Inventor 大森浩志坂口一哉胜见昌高
Owner DAIDO STEEL CO LTD
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