Spray cooling device for cooling heat source with high heat flux

A spray cooling, high heat flow technology, applied in the field of cooling devices, can solve the problem of pump power consumption and cooling capacity mismatch, and achieve the effect of ensuring normal and efficient operation, reducing flow resistance, and reducing pump power consumption

Active Publication Date: 2012-01-18
SOUTHEAST UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In order to solve the problem of mismatch between pump power consumption and cooling capacity in the structural design of the existing spray cooling system, the present invention provides a new type of spray cooling device in which the transmission pipes are arranged according to the configuration characteristics, and the cooling device can be optimally configured The transportation of working medium in the spray cooling device improves the uniformity of fluid atomization and strengthens the cooling performance of the spray cooler

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  • Spray cooling device for cooling heat source with high heat flux
  • Spray cooling device for cooling heat source with high heat flux
  • Spray cooling device for cooling heat source with high heat flux

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Embodiment Construction

[0023] Carry out further detailed description below in conjunction with accompanying drawing:

[0024] figure 1 A schematic diagram of the device of the present invention is given, a spray cooling device with a structural characteristic transmission pipeline, which is composed of a spray cooler, a condenser, a liquid reservoir and a circulation pump. The specific structure includes: a liquid reservoir 1, a condenser 2, a spray cooler 3, an atomizer 4, a circulating pump 5, and a configuration transmission pipeline 6, etc., and other main parts. In the spray cooler 3, the atomizer 4 is arranged at the outlet of the configuration transfer pipe 6, the spray cooler 3 is connected with the liquid reservoir 1 through a circulating pump 5, and the condenser 2 is arranged between the spray cooler 3 and the storage Between liquid tank 1, the whole system forms a closed cycle.

[0025] figure 2 A schematic diagram of the spray cooler structure is given. The cooling working fluid ent...

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Abstract

The invention discloses a spray cooling device for cooling a heat source with high heat flux. The spray cooling device comprises a spray cooler, a pump, a liquid storage drum and a condenser, wherein one end of the spray cooler is connected with the liquid storage drum through the pump, the other end of the spray cooler is connected with the inlet of the condenser, the outlet of the condenser is connected to the liquid storage drum, the spray cooler is internally provided with a transmission pipeline with a configuration characteristic, the inlet of the transmission pipeline with the configuration characteristic is connected with the liquid storage drum through the pump, and the outlet of the transmission pipeline with the configuration characteristic is provided with an atomizer. According to the spray cooling device provided with the transmission pipeline with the configuration characteristic, the transport optimal allocation of a working medium in the spray cooling device is realized, the evenness level of fluid atomization is improved, and the cooling performance of the spray cooler is intensified.

Description

technical field [0001] The invention designs a cooling device for cooling a heat source with a high heat flux density, and in particular relates to a spray cooling system with a configuration characteristic transmission pipeline spray cooler. Background technique [0002] Although traditional heat dissipation methods such as natural convection and forced convection are widely used, if a heat source with high heat flux density is encountered, the traditional heat dissipation method cannot effectively cool it in a short time. Therefore, better cooling methods must be found to solve this problem. [0003] The spray cooling system uses the principle of phase change after the coolant absorbs heat to enhance heat dissipation. Due to the extremely high latent heat of liquid vaporization, it is suitable for use in heat dissipation systems with high heat flux heat sources. At present, the spray cooling system has been successfully used in aerospace, high-power electronic systems, h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D5/02
Inventor 陈永平赵沐雯姚峰施明恒
Owner SOUTHEAST UNIV
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