Acidic texturing solution for texturing of polycrystalline silicon chip and using method thereof
A polycrystalline silicon wafer and texturing liquid technology, applied in chemical instruments and methods, crystal growth, post-processing details, etc., can solve problems such as uneven texture and environmental pollution, increase absorption area, avoid control requirements, and tightly arrange Effect
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Embodiment 1
[0023] Take the following process steps: 1) configure acidic texturing solution: dissolve 5 mol / liter of sodium perchlorate and 1 mol / liter of hydrofluoric acid in deionized water; 2) immerse the polycrystalline silicon wafer for solar cells in the solution The surface is textured, the texture temperature is 7°C, and the texture time is 8 minutes.
[0024] figure 1 A scanning electron microscope plane photo of the textured surface of the obtained polycrystalline silicon wafer is given. From the figure, it can be seen that a uniform pit-shaped textured surface is formed on the surface of the silicon wafer, and the textured surface has a size of about 1-5 μm.
Embodiment 2
[0026] Take the following process steps: 1) configure acidic texturing solution: dissolve the polymethylsiloxane of 30 mol / liter of sodium perchlorate and 20 mol / liter of hydrofluoric acid, 0.05% (percentage by weight) in deionized in water; 2) immerse the polysilicon wafer for solar cells in the solution for surface texturing, the texturing temperature is 10° C., and the texturing time is 5 minutes.
Embodiment 3
[0028] Take the following process steps: 1) configure acidic cashmere liquid: the octylphenol polyoxyethylene ether of 10 mol / liter of sodium perchlorate and 5 mol / liter of hydrofluoric acid, 0.2% (percentage by weight) is dissolved in Ionized water: 2) Immerse the polysilicon wafer for solar cells into the solution for surface texturing, the texturing temperature is 10° C., and the texturing time is 5 minutes.
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