Light-emitting diode (LED) radiating based on diamond microscopic graph structure

Abstract

The invention discloses a light-emitting diode (LED) radiating based on a diamond microscopic graph. The LED comprises a printed circuit board (PCB) plate (7), and is characterized in that: a heat generation surface of the PCB plate (7) contacts the bottom surface of a diamond substrate (6); a fine structure capable of improving the radiating area is arranged on the surface of the diamond substrate (6) contacting the PCB plate (7); the upper bottom surface of the diamond substrate (6) is connected with an active layer (2) through an inverted welding layer (3); the active layer (2) is grown ona sapphire (1); a P-type electrode (4) and an N-type electrode (8) for controlling the current of the active layer (2) are arranged on the diamond substrate (6) and are connected with the PCB plate (7) through corresponding electrode wires (5 and 9); and the PCB plate (7) is controlled by a temperature sensor (10) to realize current adjustment so that the luminous quantity of the active layer (2)is controlled and the LED works in the optimal temperature range. By the invention, the radiating effect is greatly improved, and the service life of an LED particle can be prolonged by over 15 percent.

Description

technical field [0001] The invention relates to an LED technology, in particular to a high-power LED with good heat dissipation effect, in particular to a heat dissipation LED based on a diamond microscopic pattern structure. Background technique [0002] As we all know, one of the outstanding advantages of LEDs that distinguishes them from traditional light sources is that they are small in size and compact in structure, and can be easily embedded in various lamps to form application systems that meet different requirements. And only when LEDs are combined with lamps can they give full play to their advantages. High-power white light LED is a new type of semiconductor solid light source, which has the advantages of strong safety and reliability, high power consumption, high luminous efficiency, strong applicability, good stability, short response time, changeable color, and environmental protection. Its performance is constantly improving and has entered the practical ...

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to design a packaging structure of LED particles with good heat dissipation performance based on the heat dissipation of diamond microscopic pattern structure, aiming at the problem that the poor heat conduction and heat dissipation performance of the silicon chip of the current LED particle mounting carrier affects the life of the LED

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