Display system with capacitive touch panel and manufacturing method thereof

Abstract

The invention provides a display system with a capacitive touch panel and a manufacturing method thereof. The display system with a capacitive touch panel comprises a substrate, an electrode circuit, a plurality of signal lines, a dielectric layer and an electrode bridging structure, wherein the electrode circuit is provided with a first electrode and a second electrode, the first electrode comprises a plurality of first conductive patterns, the second electrode comprises a plurality of second patterns, and the first conductive patterns are mutually electrically connected; the plurality of signal lines are formed on the substrate; the dielectric layer is formed on the electrode circuit and covers the electrode circuit; and in the invention, the electrode bridging structure with uniform thickness is formed on the dielectric layer by using a metal open repair technique, so that the second patterns are mutually electrically connected.

Description

【Technical field】 [0001] The present invention relates to a display system and a method thereof, in particular to a display system with a capacitive touch panel and a manufacturing method thereof. 【Background technique】 [0002] refer to figure 1 , which shows a schematic diagram of a capacitive touch panel 100 of a display system in the prior art. The capacitive touch panel 100 includes a substrate 102, an indium tin oxide (ITO) layer 104, a metal wire 106, a dielectric layer (dielectric layer) 108, a stack layer 110 and a passivation layer (passivation layer) 112, the stack Layer 110 is a conductive material. The above-mentioned physical vapor deposition (PVD) method and lithography technology are used to form the indium tin oxide (ITO) layer 104, the dielectric layer 108 and the stack layer 110 in sequence, wherein the indium tin oxide (ITO) layer 104 has a left electrode 104a and a right electrode 104b. [0003] However in figure 1 Among them, near the step edge (st...

AI Technical Summary

Problems solved by technology

[0004] Further, due to the poor step coverage of the stack layer 110, defects (defects) 111 are likely to be formed at the contact interfaces between the two ends of the stack layer 110 and the left electrode 104a and the right electrode 104b, so that the electrical The contact resistance between the stack layer 110 and the indium tin oxide (ITO) layer 104 increases due to poor contact.

Even a disconnected state occurs between the stack layer 110 and the indium tin oxide (ITO) layer 104, so that the left electrode 104a and the right electrode 104b are in an insulated state, and signals cannot be transmitted to the metal wire 106, such as figure 1 shown

[0005] According to the above, due to the uneven thickness of the stack layer 110 and poor electrical contact, it is necessary to carefully select the material of the stack layer 110 and control the thickness of the indium tin oxide (ITO) layer 104 and the dielectric layer 108, so the capacitive The process steps and material selection of the touch panel 100 are very limited

Even if the prior art intends to solve the above-mentioned problems by increasing the thickness of the stacking layer 110, in the process of vapor deposition and lithography, the stacking layer 110 is easily peeled off due to excessive thickness, which still cannot solve the problem of poor step coverage and The problem of poor electrical contact between the stacked layer 110 and the indium tin oxide (ITO) layer 104

Images