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Chip detector for SMD (Surface Mounted Device) LED (Light-Emitting Diode) chip light spitting machine

A technology of detection device and spectrometer, which is applied in the direction of measurement device, measurement device casing, measurement electricity, etc., can solve the problems of increasing equipment cost, affecting equipment work efficiency, shutdown operation, etc., and achieves simple structure, easy implementation, and guaranteed test accuracy. Effect

Inactive Publication Date: 2012-02-22
广东志成华科光电设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the biggest problem of the above-mentioned needle-shaped probe is the life of the probe. Due to the frequent replacement of the probe, the probe will be used as a wearing part and will be replaced once every less than 5 days, resulting in a continuous increase in equipment costs. Moreover, it is necessary to shut down the operation while replacing the probe, which in turn affects the working efficiency of the entire equipment

Method used

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  • Chip detector for SMD (Surface Mounted Device) LED (Light-Emitting Diode) chip light spitting machine
  • Chip detector for SMD (Surface Mounted Device) LED (Light-Emitting Diode) chip light spitting machine
  • Chip detector for SMD (Surface Mounted Device) LED (Light-Emitting Diode) chip light spitting machine

Examples

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Embodiment 1

[0036] One of the specific implementations of a chip detection device for a SMD LED patch spectrometer of the present invention, such as figure 1 , figure 2 and image 3As shown, it includes a support plate 1, one side of the support plate 1 is provided with a driving source 2, and the other side of the support plate 1 is provided with an elastic probe assembly 3 and a synchronous driving mechanism 4, and one end of the synchronous driving mechanism 4 is connected to the driving source 2 connection, the other end of the synchronous drive mechanism 4 is mated with the elastic probe assembly 3, the drive source 2 drives the synchronous drive mechanism 4, and the elastic probe assembly 3 can simultaneously contact or stay away from the core to be tested under the action of the synchronous drive mechanism 4 5. The present invention is a chip detecting device based on fixed chip 5 and moving probes. Compared with the existing technology, it has the characteristics of simple str...

Embodiment 2

[0039] The second embodiment of the chip detection device for a SMD LED patch spectrometer of the present invention is as follows: Figure 4 and Figure 5 As shown, the main technical solutions of this embodiment are the same as those of Embodiment 1, and the features not explained in this embodiment are explained in Embodiment 1, and will not be repeated here.

[0040] The difference between this embodiment and Embodiment 1 is that the elastic probe assembly 3 includes a first elastic probe assembly and a second elastic probe assembly, and the first elastic probe assembly and the second elastic probe assembly respectively include a probe Sheet 32, probe slide rail 33, slide bar 34, spring 35 and slide bar seat 36, probe slide rail 33 is provided with guide groove 331, probe sheet 32 ​​and guide groove 331 sliding fit, the tail end of probe sheet 32 It abuts against one end of the sliding rod 34 , and the other end of the sliding rod 34 cooperates with the sliding rod seat 36...

Embodiment 3

[0054] The third specific embodiment of a chip detection device for SMD LED patch spectrometer of the present invention, the main technical solution of this embodiment is the same as that of embodiment 2, and the features not explained in this embodiment are adopted in embodiment 2 The explanation will not be repeated here. The difference between this embodiment and Embodiment 2 is that the distance between the first eccentric shaft hole and the center of rotation of the rotating member 41 is equal to the distance between the second eccentric shaft hole and the center of rotation of the rotating member 41. the distance between. The synchronous drive is better satisfied, and the force is uniform without hysteresis, which improves the transmission accuracy of the first link slider mechanism and the second link slider mechanism.

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Abstract

The invention discloses a chip detector for an SMD (Surface Mounted Device) LED (Light-Emitting Diode) chip light spitting machine. The chip detector comprises a support plate; a drive source is arranged at one side of the support plate while an elastic probe assembly and a synchronous drive mechanism are arranged at the other end of the support plate; one end of the synchronous drive mechanism is connected with the drive source while the other end of the synchronous drive mechanism is connected with the elastic probe assembly; the synchronous drive mechanism is driven by the drive source; and the elastic probe assembly is driven to contact or leave a chip to be detected under the action of the synchronous drive mechanism. The chip detector disclosed by the invention is a chip detector based on chip fixture and probe movement; compared with the prior art, the chip detector has the characteristics of simple structure, easiness for implementation and capability of avoiding frequent change of a probe and ensuring the detecting precision; and the service life of the probe is more than 30 times to that of the probe of a needle structure in the prior art.

Description

technical field [0001] The invention relates to the technical field of LED spectrometers, in particular to a chip detection device for an SMD LED patch spectrometer. Background technique [0002] SMD LED is a new type of surface-mounted semiconductor light-emitting device, which has the advantages of small size, large scattering angle, good uniformity of light emission, and high reliability. The light-emitting colors include various colors including white light. Therefore, it is widely used in various electronic products such as display screens, LCD panel backlights, decorative lighting, and general lighting. [0003] Because the LED packaging must be processed by color separation and light separation before leaving the factory, the LEDs are divided into many bins and categories according to parameters such as wavelength, brightness and operating voltage, and then the LEDs are automatically divided into different Bin tubes according to the set test standards. [0004] LED s...

Claims

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Application Information

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IPC IPC(8): G01R31/26G01R1/04G01R1/067G01R31/44
Inventor 吴涛李斌秦小平
Owner 广东志成华科光电设备有限公司
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