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Method for manufacturing cured product of thermosetting resin composition and cured product obtained thereby

A technology of resin composition and cured products, which is applied in the direction of electric solid-state devices, semiconductor/solid-state device components, electrical components, etc., to achieve excellent heat resistance and curing properties, and excellent long-term heat resistance

Inactive Publication Date: 2012-03-14
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the reality is that no research has been done to improve heat resistance by aggressively curing allyl groups

Method used

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  • Method for manufacturing cured product of thermosetting resin composition and cured product obtained thereby
  • Method for manufacturing cured product of thermosetting resin composition and cured product obtained thereby
  • Method for manufacturing cured product of thermosetting resin composition and cured product obtained thereby

Examples

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Effect test

Embodiment

[0060] Examples and comparative examples of the present invention will be described below. However, the present invention should not be construed as being limited to these Examples. Incidentally, "parts" and "%" in the examples are defined as "parts by weight" and "% by weight", respectively, unless otherwise specified.

[0061] First, before preparing a thermosetting resin composition, an allylated phenolic resin was synthesized (Synthesis Examples A-1 to A-5).

Synthetic example A-1

[0063]p-phenolic resin (GS-180, manufactured by Gunei Chemical Industry Co., Ltd., phenol equivalent: 105 g / eq.) (105 parts), 181.5 parts of allyl bromide (produced by Tokyo Chemical Tokyo Chemical Industry Co., Ltd.), 207.3 parts of potassium carbonate (manufactured by Wako Pure Chemical Industries, Ltd.), and 500 parts of acetone (manufactured by Wako Pure Chemical Industries, Ltd. Co., Ltd.) were mixed, and refluxed for 24 hours under heating in a nitrogen stream. After cooling to room temperature (25° C.), filtration and concentration were performed, and 400 parts of ethyl acetate (manufactured by Wako Pure Chemical Industries, Ltd.) was added to the residue, followed by 200 parts of a 5% hydrochloric acid solution diluted with distilled water ( manufactured by Wako Pure Chemical Industries, Ltd.) and washed once with 200 parts of distilled water. Thereafter, the organic layer was extracted and dried with magnesium sulfate (manufactured by Wako Pure Chemical Industries, L...

Synthetic example A-2

[0065] p-phenolic resin (GS-180, manufactured by Qunei Chemical Industry Co., Ltd., phenol equivalent: 105 g / eq.) (105 parts), 90.7 parts of allyl bromide (manufactured by Tokyo Chemical Industry Co., Ltd.), 138.2 parts of potassium carbonate (manufactured by Wako Pure Chemical Industries, Ltd.) and 500 parts of acetone (manufactured by Wako Pure Chemical Industries, Ltd.) were mixed, and refluxed under heating in a nitrogen stream for 24 hours. After cooling to room temperature (25° C.), filtration and concentration were performed, and 400 parts of ethyl acetate (manufactured by Wako Pure Chemical Industries, Ltd.) was added to the residue, followed by 200 parts of a 5% hydrochloric acid solution diluted with distilled water ( manufactured by Wako Pure Chemical Industries, Ltd.) and washed once with 200 parts of distilled water. Thereafter, the organic layer was extracted and dried with magnesium sulfate (manufactured by Wako Pure Chemical Industries, Ltd.), followed by filtr...

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Abstract

The present invention relates to a method for producing a cured product of a thermosetting resin composition and a cured product obtained thereby. The method includes: heating a thermosetting resin composition including the following ingredients (A) to (C) at a temperature of 100 to 200 DEG C for 1 to 60 minutes; and then further heating the thermosetting resin composition at a temperature of 220 to 350 DEG C for 10 to 6,000 minutes, thereby curing the thermosetting resin composition: (A) an allylated phenol resin; (B) an epoxy resin; and (C) a curing accelerator.

Description

technical field [0001] The present invention relates to a method for producing a cured product of a thermosetting resin composition used for encapsulating materials requiring high heat resistance in power devices and the like, and a cured product obtained thereby Excellent in heat and heat cycle resistance. Background technique [0002] Generally, semiconductor devices have heretofore been manufactured by packaging semiconductor elements such as transistors, ICs, and LSIs with ceramic packages, plastic packages, and the like. The former ceramic package has excellent durability under high temperature and high humidity because its constituent material itself has heat resistance and also has excellent moisture resistance, and additionally has excellent mechanical strength. Therefore, highly reliable packaging is possible. However, the above-mentioned ceramic package has problems in that the constituting material is relatively expensive and the mass yield of the package is poo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/62C08J3/24C08L63/04H01L23/29
CPCC08G59/621C08J3/244C08J3/247C08J2361/14C08J2363/00C08L61/06C08L63/00C08G59/40C08G59/62H01L23/29
Inventor 山本瑞木
Owner NITTO DENKO CORP
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