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Graphene filling isotropic high-performance conducting adhesive and preparation method thereof

An isotropic, graphene-based technology, applied in the direction of conductive adhesives, adhesives, epoxy glue, etc., can solve the problems of low conductivity and low bonding strength, and achieve high conductivity, low cost and low cost Effect

Inactive Publication Date: 2012-03-21
CHANGZHOU HE RUN NEW MATERIAL TECH +1
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  • Abstract
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  • Claims
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Problems solved by technology

[0007] The purpose of the present invention is to provide a high-performance conductive adhesive composition with high mechanical strength, good heat resistance, high bonding strength, and high electrical conductivity in order to overcome the low electrical conductivity and low bonding strength of the existing conductive adhesives. And provide the preparation method of conductive adhesive composition

Method used

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  • Graphene filling isotropic high-performance conducting adhesive and preparation method thereof
  • Graphene filling isotropic high-performance conducting adhesive and preparation method thereof

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Embodiment 1～11

[0039] According to the ingredients and dosage listed in Table 2, weigh the matrix epoxy resin and the core-shell structure toughened epoxy resin and mix them. The mixing method is mechanical stirring at a stirring rate of 1000 rpm for 10 minutes. Then add the weighed surface-treated graphene and fumed silica to the mixture in a stirring state. After the addition, continue to stir for 10 minutes. After mixing evenly, add a curing agent and a curing accelerator to the mixture, and mechanically stir. After 5 minutes, the mixture was transferred to a high-speed shear mixer for mixing, and the mixing rate was 2000 rpm, and the time was 30s. Repeat the mixing process in the high-speed shear mixer for 3 times to obtain a uniform jelly. Conductive plastic.

[0040]

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Abstract

The invention belongs to the technical field of conducting adhesive preparation and particularly relates to a preparation method of a graphene filling isotropic high-performance conducting adhesive. Graphene prepared in a ball-milling mode is adopted as a conducting filler, surface active agents including sodium dodecyl sulfate or silane coupling agent KH550 and the like are adopted to process the graphene to enable the dispersion degree of the graphene in the conducting adhesive to be increased, and the prepared high-performance conducting adhesive can be widely applied to the electronic packaging industry and has extremely remarkable effects.

Description

technical field [0001] The invention belongs to the technical field of conductive adhesive preparation, in particular to a preparation method of graphene-filled isotropic high-performance conductive adhesive. Background technique [0002] With the vigorous development of electronic science and technology, higher and stricter requirements are put forward for electronic packaging technology. The Sn / Pb solder currently used in the fields of electronics, home appliances, energy, and automobiles has low cost, low melting point, and high strength. , good processing plasticity, good wettability, etc., but there are many problems that cannot be ignored, such as poor creep resistance, high density, poor wettability with organic materials, high connection temperature, etc., which can no longer adapt to the development of modern electronic products to light type. requirements, and lead is a heavy metal substance, which is not conducive to environmental protection. Therefore, conductive...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J11/04C09J9/02
Inventor 陶宇吴海平陶新永李斌夏艳平陶国良
Owner CHANGZHOU HE RUN NEW MATERIAL TECH
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