Compact laser chip

Abstract

The invention relates to the design and manufacturing of a compact laser chip, which utilizes a 1.06-um fundamental frequency laser of a laser crystal Nd: YVO4, and obtains 0.53-um frequency doubling green light through frequency doubling of nonlinear crystal PPLN (periodically poled lithium niobate). The chip comprises a laser crystal Nd: YVO4, a nonlinear crystal PPLN [or potassium titanyl oxygenic phosphate (KTP), lithium triborate (LBO), periodically poled potassium titanyl oxygenic phosphate (PPKTP), periodically poled lithium tantalite (PPLT) and the like), heat sink Si or AIN, and a resonant cavity consisting of optical films plated on the surfaces of two crystals. The compact laser chip is characterized in that the laser crystal and the nonlinear crystal are welded (or glued) on the heat sinking through welding flux (glue) under the situation that two cavity surfaces are ensured to be parallel. The laser chip structure has a simple structural design, small volume, low cost, and convenience in mass production; and when the compact laser chip is used, a suitable semiconductor pumping source is matched so that the green light with specific wavelength can be output, and the compact laser chip is expected to be widely applied in laser display.

Description

technical field [0001] The invention belongs to the field of laser technology, in particular to the design and preparation of a compact laser chip. Background technique [0002] Compared with other existing display technologies such as plasma and liquid crystal, laser display technology has incomparable advantages in terms of brightness and color gamut, and its promotion and application require small, low-cost red-green-blue (RGB ) laser. LD-pumped all-solid-state green lasers mostly use Nd:YVO4 crystal material with 1.06um fundamental frequency light, which is frequency-multiplied by nonlinear crystal KTP (or LBO) to obtain 0.53um frequency-doubled green light. Such as figure 1 As shown, the total reflection mirror, output mirror, Nd:YVO4 crystal, and KTP crystal that constitute the resonator are all separate components and need to be adjusted one by one, which brings a series of problems such as large volume, difficult adjustment, and high cost to the laser. [0003] Mo...

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Problems solved by technology

like figure 2 As shown, due to errors in the crystal orientation, processing, alignment and curing process, the bonding yield is low, generally at 50%, which greatly increases the cost of the device, and the device is easy to form during the working process.

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