The invention relates to the design and manufacturing of a compact laser chip, which utilizes a 1.06-um fundamental frequency laser of a laser crystal Nd: YVO4, and obtains 0.53-um frequency doubling green light through frequency doubling of nonlinear crystal PPLN (periodically poled lithium niobate). The chip comprises a laser crystal Nd: YVO4, a nonlinear crystal PPLN [or potassium titanyl oxygenic phosphate (KTP), lithium triborate (LBO), periodically poled potassium titanyl oxygenic phosphate (PPKTP), periodically poled lithium tantalite (PPLT) and the like), heat sink Si or AIN, and a resonant cavity consisting of optical films plated on the surfaces of two crystals. The compact laser chip is characterized in that the laser crystal and the nonlinear crystal are welded (or glued) on the heat sinking through welding flux (glue) under the situation that two cavity surfaces are ensured to be parallel. The laser chip structure has a simple structural design, small volume, low cost, and convenience in mass production; and when the compact laser chip is used, a suitable semiconductor pumping source is matched so that the green light with specific wavelength can be output, and the compact laser chip is expected to be widely applied in laser display.