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A polysilicon laser annealing method for thin film transistors

A thin-film transistor and laser annealing technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as uneven display and uneven striped display of organic light-emitting display panels

Active Publication Date: 2016-05-25
CHENGDU VISTAR OPTEOLECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] In order to solve the problem of uneven striped display of organic light-emitting display (OLED) panels in the excimer laser annealing method in the current low-temperature polysilicon preparation process, it is necessary to provide a method that can suppress display unevenness without affecting other characteristics of thin film transistors. Low temperature polysilicon laser annealing method

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  • A polysilicon laser annealing method for thin film transistors
  • A polysilicon laser annealing method for thin film transistors
  • A polysilicon laser annealing method for thin film transistors

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] The laser annealing method of the low-temperature polysilicon comprises the following four steps:

[0022] 1. A substrate 1 is provided, and a buffer layer 4 is first formed on the substrate 1 by a low-pressure chemical vapor deposition (CVD) method, and then an amorphous silicon film 5 is deposited.

[0023] The substrate 1 is a glass substrate, and the buffer layer 4 is a structure composed of silicon dioxide and silicon nitride to prevent impurities in the substrate 1 from diffusing in subsequent processes and affecting the polysilicon film. The buffer layer 4 and the amorphous silicon film 5 Made by chemical vapor deposition.

[0024] 2. An excimer laser generator 2 is provided, which can emit a pulsed laser beam 3, and the pulsed laser beam 3 irradiates the amorphous silicon thin film 5 to form an irradiated area, so that the irradiated area is in a molten state;

[0025] After the amorphous silicon film 5 is deposited on the glass substrate 1, after dehydrogenati...

Embodiment 2

[0030] The difference between the present embodiment and the first embodiment is that the scanning pitch varies within the range of 0.9-1.1 times of the average scanning pitch, and the others are the same as the embodiment.

[0031] If the scanning spacing changes within the range of 0.9 to 1.1 times the average scanning spacing, and control the change between the next scanning spacing and the previous scanning spacing to not exceed 0.1 times the average scanning spacing. Assuming that the average scan pitch is 20um, the scan pitch values ​​for the 1st to 8th times are 20um, 19um, 20um, 18um, 20um, 21um, 22um, 20um.

[0032]In the above embodiments, the scanning distance is only possible, and other values ​​may be generated, as long as the scanning distance is changed within the range of 0.8 to 1.2 times of the set average scanning distance, and the scanning distance of the next time is controlled to be different from that of the previous time. It is sufficient that the differ...

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Abstract

The invention relates to a polycrystalline silicon laser annealing method for film transistor, which comprises the following steps of: 1, providing a base plate, and forming a non polycrystalline silicon film on the base plate; 2, providing a quasimolecular laser generator which can emit a pulse laser beam that irradiates the non polycrystalline silicon film to form an irradiation region, and making the irradiation region be in molten state; 3, translating the base plate by a scanning interval, and emitting a pulse laser beam again by the quasimolecular laser generator, wherein the scanning interval is changed in the range of 0.8-1.2 times greater than average scanning interval, and the difference between the two scanning intervals is in the range of 0.1 times greater than the average scanning interval; and 4, repeating the step 3 until completing laser irradiation of the whole base plate. The scanning interval is changed in the range of 0.8-1.2 times greater than the average scanning interval, and the difference between the two scanning intervals is in the range of 0.1 times greater than the average value, so that not only can display unevenness easily caused in the quasimolecular laser annealing technology be inhibited, but also overlarge difference of film transistor characteristics will not be resulted, thereby improving display quality.

Description

technical field [0001] The invention relates to a manufacturing method for a thin film transistor, in particular to an excimer laser annealing method in the manufacturing process of a low-temperature polysilicon thin film transistor. Background technique [0002] In organic light-emitting displays, it is necessary to configure switches to drive. The configuration of these switches can be divided into two types: active matrix and passive matrix. Since the active matrix configuration has the advantages of continuous light emission and low-voltage drive, so In recent years, this configuration has been widely used in organic light-emitting displays. In an active matrix organic light-emitting display, the switch can be a thin film transistor (thinfilm transistor, TFT for short) or a thin film diode, etc., and a thin film transistor can be divided into amorphous silicon (amorphous silicon, short for short) according to the material of the channel region. a-Si) thin film transisto...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/268H01L21/336
Inventor 森本佳宏邱勇黄秀颀陈红魏朝刚
Owner CHENGDU VISTAR OPTEOLECTRONICS CO LTD