LED (Light-Emitting Diode) heat dissipation base plate, LED packaging structure, and manufacturing method of LED heat dissipation base plate and LED packaging structure

Abstract

The invention discloses an LED (Light-Emitting Diode) heat dissipation base plate, an LED packaging structure and a manufacturing method of the LED heat dissipation base plate and the LED packaging structure. An SOI (Silicon-On-Insulator) wafer or a monocrystalline silicon wafer is taken as a substrate. The heat dissipation base plate taking the SOI wafer as the substrate comprises an upper layermade of silicon materials, an etching stopping layer made of silicon dioxide materials and a bottom layer made of the silicon materials, wherein the upper layer comprises a silicon cup formed by etching; the etching stopping layer is positioned in the SOI wafer below the upper layer; and the bottom layer comprises at least two guide holes formed by etching. The heat dissipation base plate taking the monocrystalline silicon wafer as the substrate comprises a silicon cup, at least two guide holes and metal conductors, wherein the silicon cup is formed by etching on a first surface; the guide holes are formed by etching on a second surface; and the metal conductors are filled in the guide holes. The invention has the beneficial effects that a silicon-manufactured base plate is adopted to replace the existing various ceramic heat dissipation base plates; the structure is simple; not only can the purpose of highly-efficient heat dissipation be achieved, but also the basic production cost can be greatly reduced; and meanwhile, as the thermal expansion coefficient of a silicon is close to that of an LED chip substrate, the service life of an LED chip is facilitated to be prolonged.

Description

technical field [0001] The invention relates to the field of LED semiconductors, in particular to a heat dissipation substrate for packaging high-power LED chips, an LED packaging structure using the heat dissipation substrate, and a manufacturing method for the two. Background technique [0002] With the rising awareness of global environmental protection and the rapid progress of optoelectronic technology, the LED semiconductor lighting industry with energy saving, power saving, high efficiency, fast response time, long life cycle, and mercury-free is rapidly becoming one of the hottest industries. At present, low-power LED light-emitting diode chips have been widely used in display screens, backlights for LCD TVs and computer screens, as well as interior decoration and general lighting. However, the largest market for LEDs in the future is street lighting, and this application requires the use of high-power, high-brightness LED chips, and has high requirements for the ove...

AI Technical Summary

Problems solved by technology

However, at present, the production and packaging technology of silicon substrates are basically mastered by foreign companies, and the design is complicated and the cost is high

For example, the manufacturing process of the silicon substrate in the "Using an Etch Stop Layer to Form Through-Wafer Electrical Interconnects and Other Structures" disclosed in the Chinese patent document CN 101517729A and the "Semiconductor Structure with One or More Through Holes" disclosed in the Chinese patent document CN1605126A are both Very complex, correspondingly high cost, not suitable for promotional use

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