Air guiding heat dissipation device for computer

Abstract

The invention relates to an air guiding heat dissipation device for a computer; the air guiding heat dissipation device is characterized in that the air guiding heat dissipation device is an air guiding pipe which is provided with a tapered ventilating duct and is arranged in the computer; the tapered ventilating duct is arranged in the middle of the air guiding heat dissipation device; a large caliber area and a small caliber area are respectively arranged at two ends of the tapered ventilating duct; a cooling fan is arranged in the large caliber area of the air guiding heat dissipation device; and a heating chip or a cooling fin on a radiator of the heating chip are arranged at the outer side of a port of the smaller caliber area of the air guiding device or embedded in the smaller caliber area. As the air guiding device has the bottleneck effect, wind speed larger than that of the lager caliber area is formed in gaps of the cooling fin in the smaller caliber area of the air guiding device when the fan in the large caliber area is started; and compared with the prior art that the fan is attached on the cooling fin, the air guiding heat dissipation device greatly increases the heat dissipation efficiency. The computer adopting the air guiding heat dissipation device has the advantages of low cost, light weight and achieved ultra-low-noise effect in case of high configuration and high load.

Description

technical field [0001] The invention relates to the field of computer heat dissipation, in particular to a computer air guide and heat dissipation device. Background technique [0002] The power supply fan on the computer, the fan on the CPU heat sink and the fan on the graphics card heat sink usually all make certain noises, and the heat dissipation method under the prior art is usually that the fan is directly attached to the heat sink of the heat sink to blow hot air into the chassis, and then use The power supply fan and chassis auxiliary fan draw hot air out of the chassis. In this way, no matter how you reduce the noise of the fan on the heat sink, the noise from the power supply fan and the chassis auxiliary fan still exists. The mute effect of the computer under the prior art can usually only be achieved at a low load, and the noise is still obvious when used in a very quiet environment. [0003] figure 1 It is a schematic diagram of the plane structure of an ordi...

AI Technical Summary

Problems solved by technology

If the rotating speed of the power supply fan 101 is greatly reduced in order to reduce noise, the heat emitted from the CPU and the graphics card cannot be discharged out of the chassis quickly, and the heat remaining in the chassis will cause the overall temperature inside the chassis to rise, resulting in heat dissipation for the CPU and the graphics card. Increased airflow temperature reduces cooling efficiency

[0004] Under the existing technology, even in the case of low configuration, the speed of the power supply fan cannot be reduced to the point where no noise can be heard

When the computer configuration is high and it is running under high load, in order to let the heat out of the chassis as soon as possible, it is necessary to add an auxiliary chassis fan and increase the fan speed to meet the heat dissipation requirements, and the noise is inevitable.

In addition, long-term excessive airflow will bring more dust into the chassis, causing the heat sink to be blocked by dust, further affecting the heat dissipation effect

If the computer does not have a front auxiliary fan and is placed under a closed desk at the back, the hot air cannot be discharged normally because the rear air intake and exhaust vent are too close, and in severe cases, the computer will overheat and shut down

Images