Air guiding heat dissipation device for computer

A technology of heat dissipation device and air guide device, which is applied in computing, instrumentation, electrical and digital data processing, etc., can solve the problems of temperature rise, unavoidable noise, affecting heat dissipation effect, etc., and achieve the effect of reducing heat dissipation efficiency.

A technology of heat dissipation device and air guide device, which is applied in computing, instrumentation, electrical and digital data processing, etc., can solve the problems of temperature rise, unavoidable noise, affecting heat dissipation effect, etc., and achieve the effect of reducing heat dissipation efficiency.

CN102419624AInactive Publication Date: 2012-04-18周志农
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  • Air guiding heat dissipation device for computer
  • Air guiding heat dissipation device for computer
  • Air guiding heat dissipation device for computer

Examples

Experimental program
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Effect test

Embodiment 1

[0035] figure 2 , image 3 It is a schematic diagram of plane and three-dimensional structure of a general performance computer installed with the air guide and heat dissipation device of the present invention. The machine is a general-purpose ATX vertical structure, equipped with a dual-core CPU with a maximum power consumption of 65W, and an integrated graphics card. The chassis power supply is an active high-efficiency power supply with a rated power of 200W and a 120mm-caliber fan. A fan, a radiator with a heat pipe is used on the CPU. The port of the large-diameter area of ​​the air-guiding heat-dissipating device is closely attached to the air inlet of the power supply of the chassis, the CPU heat sink is embedded in the port of the small-diameter area of ​​the air-guiding heat-dissipating device, and the end mask of the small-diameter area of ​​the air-guiding heat-dissipating device is above the north bridge radiator of the main board. Pull out the fan wire from the...

Embodiment 2

[0040] Figure 4 , Figure 5 It is a schematic diagram of plane and three-dimensional structure of a high-performance computer installed with the air guide and heat dissipation device of the present invention. The machine is a general-purpose ATX vertical structure, equipped with a 4-core CPU with a maximum power consumption of 95W and a high-end graphics card with a maximum power consumption of 125W. The power supply of the chassis is an active high-efficiency power supply with a rated power There is a 120mm caliber graphics card cooling fan. Install a radiator with heat pipes and corresponding air guide cooling devices on the CPU and graphics card. Pull out the fan wire from the power box of the chassis and connect it to the fan reducer together with the graphics card cooling fan wire.

[0041] Heat dissipation process: (1) Upper part: cold air enters the case from the air inlet 110 on the front panel, passes through the north bridge radiator 104 of the motherboard, enters th...

Embodiment 3

[0044] Figure 6 , Figure 7 Schematic diagram of the plane and three-dimensional structure of an ultra-high-performance computer installed with the air guide and heat dissipation device of the present invention:

[0045] The chassis is a general-purpose ATX vertical structure, equipped with a 6-core CPU with a maximum power consumption of 125W and a top-level graphics card with a maximum power consumption of 250W. The chassis power supply is an active high-efficiency power supply with a rated power of 500W and a 120mm diameter fan. The air inlet of this machine is on the side panel and the rear baffle, and the radiator with heat pipe and the corresponding air guide and heat dissipation device are installed on the CPU and the graphics card. Because the graphics card generates a lot of heat under high load, an air guide cooling device with two 120mm diameter fans is installed, and the fan wires are pulled out from the power supply box and connected to the fan reducer together ...

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Abstract

The invention relates to an air guiding heat dissipation device for a computer; the air guiding heat dissipation device is characterized in that the air guiding heat dissipation device is an air guiding pipe which is provided with a tapered ventilating duct and is arranged in the computer; the tapered ventilating duct is arranged in the middle of the air guiding heat dissipation device; a large caliber area and a small caliber area are respectively arranged at two ends of the tapered ventilating duct; a cooling fan is arranged in the large caliber area of the air guiding heat dissipation device; and a heating chip or a cooling fin on a radiator of the heating chip are arranged at the outer side of a port of the smaller caliber area of the air guiding device or embedded in the smaller caliber area. As the air guiding device has the bottleneck effect, wind speed larger than that of the lager caliber area is formed in gaps of the cooling fin in the smaller caliber area of the air guiding device when the fan in the large caliber area is started; and compared with the prior art that the fan is attached on the cooling fin, the air guiding heat dissipation device greatly increases the heat dissipation efficiency. The computer adopting the air guiding heat dissipation device has the advantages of low cost, light weight and achieved ultra-low-noise effect in case of high configuration and high load.

Description

technical field [0001] The invention relates to the field of computer heat dissipation, in particular to a computer air guide and heat dissipation device. Background technique [0002] The power supply fan on the computer, the fan on the CPU heat sink and the fan on the graphics card heat sink usually all make certain noises, and the heat dissipation method under the prior art is usually that the fan is directly attached to the heat sink of the heat sink to blow hot air into the chassis, and then use The power supply fan and chassis auxiliary fan draw hot air out of the chassis. In this way, no matter how you reduce the noise of the fan on the heat sink, the noise from the power supply fan and the chassis auxiliary fan still exists. The mute effect of the computer under the prior art can usually only be achieved at a low load, and the noise is still obvious when used in a very quiet environment. [0003] figure 1 It is a schematic diagram of the plane structure of an ordi...

Claims

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Application Information

Patent Timeline
18 Apr 2012
Publication
CN102419624A
IPC
G06F1/20
Inventors
周志农