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Plasma equipment with function of treating coiled circuit board material

A circuit board and plasma technology, applied in the direction of plasma, ion implantation plating, metal material coating technology, etc., can solve the problems of complex processing process, increased production cost, cumbersome processing procedures, etc., achieve simple equipment operation, improve production Efficiency and the effect of simplifying the production process

Inactive Publication Date: 2012-05-02
BOFFOTTO ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This not only makes the processing process complicated, the processing procedures are cumbersome, and the production efficiency is extremely low, but also greatly increases the production cost.

Method used

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  • Plasma equipment with function of treating coiled circuit board material
  • Plasma equipment with function of treating coiled circuit board material
  • Plasma equipment with function of treating coiled circuit board material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] like Figure 1 to Figure 3 As shown, in this embodiment, the present invention includes a frame 1 and a vacuum chamber 2 disposed in the frame 1 . Inside the vacuum cavity 2 are provided a discharge shaft 3 , a collection shaft 4 , at least two pairs of positive and negative electrodes 5 arranged in parallel, and several guide shafts. In this embodiment, the number of positive and negative electrodes 5 is set to two pairs. At this time, the number of the guide shafts is set to four, which are respectively guide shaft I81, guide shaft II82, guide shaft III83, and guide shaft IV84, as figure 2 shown. Each of the positive electrodes is electrically connected to a peripheral radio frequency power supply, and each of the negative electrodes is grounded. A servo motor I6 is arranged on the shaft end of the receiving shaft 4, and the roll material 10 is discharged from the discharging shaft 3, passes between each pair of positive and negative electrodes 5 through the guide...

Embodiment 2

[0024] like Figure 4 As shown, the difference between the present embodiment and the first embodiment is that a servo motor II7 is provided on the shaft end of the discharging shaft 3 via a clutch 9, and a brake assembly is provided on the servo motor II7. The discharging shaft 3 is driven to rotate by the servo motor II7. Through the brake assembly provided on the servo motor II7, the processed roll material 10 can maintain a certain tension.

[0025] At this time, the servo motor II7 performs reverse rotation in the opposite direction to the servo motor I6, so that the processed roll material 10 wound on the receiving shaft 4 can be rewound back to the On the unwinding shaft 3, the coiled material 10 is subjected to plasma treatment again, which greatly improves the working efficiency. That is, through the setting of the servo motor I6 and the servo motor II7, the exchange between the discharging shaft and the receiving shaft can be realized, and a bidirectional function ...

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PUM

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Abstract

The invention discloses plasma equipment, and aims to provide plasma equipment with a function of treating a coiled circuit board material, which is easy to operate, has the advantages of saving in cost and high production rate, and can be used for directly treating a coiled material. The equipment comprises a frame (1) and a vacuum cavity (2) formed in the frame (1), wherein a discharging shaft (3), a receiving shaft (4), at least two pairs of positive and negative electrodes (5) which are arranged in parallel and a plurality of guide shafts are arranged in the vacuum cavity (2); each positive electrode is electrically connected with a peripheral radiofrequency power supply; each negative electrode is grounded; a servo motor I (6) is arranged at the shaft end of the receiving shaft (4) through a clutch (9); and a coiled material is discharged from the discharging shaft (3), passes through the space between each pair of positive and negative electrodes (5) through the guide shafts, and is received in the receiving shaft (4) at last. The equipment can be widely applied to the field of plasma equipment.

Description

technical field [0001] The present invention relates to a plasma device for processing rolled circuit board material. Background technique [0002] Plasma treatment equipment is widely used in plasma cleaning, etching, plasma plating, plasma coating, plasma ashing and surface activation, modification and other occasions. Through its treatment, the wetting ability of the material can be improved, so that various materials can be coated, plated, etc., the adhesion and bonding force can be enhanced, and organic pollutants, oil or grease can be removed at the same time. In existing plasma processing equipment, only single sheets of material can be processed. For the roll circuit board material, it must be processed into a single piece before it can be processed by the existing plasma processing equipment. This not only makes the processing process complicated, the processing procedures are cumbersome, and the production efficiency is extremely low, but also greatly increases t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/22C23C16/44B29C59/14H05H1/00
Inventor 丁雪苗梁冠雄
Owner BOFFOTTO ELECTRONICS TECH