Device for debugging wafer-level test scheme under final test environment of automatic test device

Abstract

The invention belongs to the technical field of integrated circuits, is used for debugging a wafer-level test scheme under the final test environment of an automatic test device, and discloses a device for debugging the wafer-level test scheme under the final test environment of the automatic test device. The device comprises automatic test equipment, a wafer prober interface, a pogo tower and probe cards. The device is characterized by also comprising a probe ring and a printed circuit board. By adoption of the device, a wafer test program can be directly debugged for a packaging sample wafer without a prober; a wafer test signal can be monitored in the final test environment, after debugging, a relevant debugging tool is taken away, and the same probe cards and the program can be directly used for wafer-level mass production test; the device is simple in structure and short in development and debugging time period; a signal can be directly and effectively observed; and the development and debugging of a wafer-level test program are greatly facilitated.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a device for debugging a wafer-level test scheme under the final test environment of an automatic test device. Background technique [0002] In the field of integrated circuit (IC) design and manufacturing technology, there is a need to eliminate the false and save the real, to screen defective products, prevent them from entering the next process, and reduce redundant manufacturing costs in the next process, which requires debugging and testing. [0003] The equipment required for debugging and testing is automatic test equipment, referred to as ATE (Automatic Test Equipment). ATE exists in each link of the front end and the back end, depending on the requirements of the process design, to detect the functional integrity of integrated circuits to ensure the quality of integrated circuit manufacturing. [0004] The current chip manufacturers need smaller chip size but req...

AI Technical Summary

Problems solved by technology

It is difficult for probe cards to provide debugging methods such as signal monitoring, so engineers spend a lot of time setting up wafers (wafers) and probe stations, and it takes a lot of money to make the results of wafer testing consistent with the results of final testing (FT). In the current period when speed to market is critical, how to quickly complete wafer-level program development and testing has become an urgent problem to be solved in the field of integrated circuit technology

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