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Lithographic apparatus for transferring pattern from patterning device onto substrate, and damping method

A technology for lithography equipment and patterns, which is applied in microlithography exposure equipment, optomechanical equipment, photo-engraving process of pattern surface, etc. performance degradation, etc.

Active Publication Date: 2014-07-09
ASML NETHERLANDS BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This effect may be degraded due to the fact that the resonant frequency of the first frame can be close to the resonant frequency of other masses connected to the first frame via the support frame
As a result, the imaging performance of the lithographic apparatus is unsatisfactory
[0006] In addition, the movement of the first frame may cause deformation of the frame
Because the first frame is usually used to support the sensor used to measure the position of the optical element, deformation of these frames may cause the position error of the optical element, again leading to the degradation of the imaging performance of the lithographic apparatus

Method used

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  • Lithographic apparatus for transferring pattern from patterning device onto substrate, and damping method
  • Lithographic apparatus for transferring pattern from patterning device onto substrate, and damping method
  • Lithographic apparatus for transferring pattern from patterning device onto substrate, and damping method

Examples

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Embodiment Construction

[0015] figure 1 A lithographic apparatus according to an embodiment of the invention is schematically shown. The apparatus includes: an illumination system (illuminator) IL configured to condition a radiation beam B (e.g., ultraviolet (UV) radiation or any other suitable radiation); a patterning device support structure or a mask support structure (e.g., a mask stage) MT configured to support a patterning device (eg mask) MA and connected to a first positioning device PM configured to precisely position the patterning device according to specified parameters. The apparatus also includes a substrate table (e.g., wafer table) WT, or "substrate support," configured to hold a substrate (e.g., a resist-coated wafer) W and configured to A second positioner PW for precisely positioning the substrate is connected. The apparatus further comprises a projection system (e.g. a refractive projection lens system) PS configured to project the pattern imparted to the radiation beam B by the...

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Abstract

The present invention relates to a lithographic apparatus and damping method for transferring a pattern from a patterning device to a substrate. The lithographic apparatus of the present invention comprises: a support frame supported by the base via a vibration isolation system; a projection system arranged to transfer the pattern from the patterning device to the substrate, wherein the projection system comprises a spring supported by the support frame a first frame; and an active damping system configured to damp movement of the first frame, the active damping system comprising: a first sensor system configured to provide a first sensor output indicative of absolute movement of the first frame; a first actuation an actuator system arranged to apply a force between the first frame and the support frame; and a control system configured to provide a drive signal to the first actuator system based on the first sensor output.

Description

technical field [0001] The invention relates to a lithographic apparatus for transferring a pattern from a patterning device onto a substrate and a damping method for a first frame of the apparatus. Background technique [0002] A lithographic apparatus is a machine that applies a desired pattern to a substrate, usually a target portion of the substrate. For example, lithographic equipment may be used in the manufacture of integrated circuits (ICs). In this case, a patterning device, alternatively referred to as a mask or reticle, may be used to generate the circuit pattern to be formed on the individual layers of the IC. The pattern can be transferred onto a target portion (eg, comprising a portion, one or more dies) on a substrate (eg, a silicon wafer). Typically, the pattern is transferred via imaging onto a layer of radiation sensitive material (resist) provided on the substrate. . Typically, a single substrate will contain a network of adjacent target portions that ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20
CPCG03F7/709G03F7/7085G03F7/70833H01L21/0275
Inventor H·巴特勒M·H·H·奥德尼惠斯
Owner ASML NETHERLANDS BV