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Method for adjusting laser processing parameters and laser machining machine for adjusting parameters automatically

A laser and parameter technology, applied in the field of parameter adjustment, can solve problems such as affecting process efficiency, difficult analysis, and labor-intensive

Active Publication Date: 2012-05-23
李俊豪
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Furthermore, there are also difficulties in analyzing
Therefore, experts with laser calibration experience usually need to directly adjust the process results on the production line, repeated testing, affecting process efficiency and consuming manpower

Method used

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  • Method for adjusting laser processing parameters and laser machining machine for adjusting parameters automatically
  • Method for adjusting laser processing parameters and laser machining machine for adjusting parameters automatically
  • Method for adjusting laser processing parameters and laser machining machine for adjusting parameters automatically

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Embodiment Construction

[0037] Specific embodiments are listed below to describe the content of the present invention in detail, and drawings are used as auxiliary descriptions. The symbols mentioned in the description refer to the symbols of the drawings.

[0038] The types of lasers can be divided into continuous wave lasers (Continuous Wave laser, CW laser) and pulsed lasers (Pulsed laser) according to the power variation. The pulsed laser can be subdivided into general pulsed laser, Q-switched laser and mode-lock laser (Mode-lock laser), the pulse time is about 10 -3 to 10 -6 Seconds, several to hundreds of 10 -9 seconds and 10 -12 to 10 -15 Second. Herein, the first embodiment of the present invention is used for vector mode process, especially refers to vector movement processing with Q-switch laser; the second embodiment of the present invention is used for discrete point motion mode process, especially refers to general pulsed laser Shot for lattice motion processing. The following emb...

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PUM

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Abstract

The invention relates to a method for adjusting laser processing parameters. The method is used for adjusting a plurality of laser parameters of Q switch laser and comprises the following steps of: acquiring the range of candidate numbers of the laser parameters by experiments, wherein the laser parameters comprise the depth of focal length, Q switch frequency and laser power; acquiring the optimum parameter number combination which meets the quality requirement of processing by the experiments in a combination of an upper limit value, a lower limit value and an intermediate value within the range of the candidate numbers of the laser parameters; updating the range of the candidate numbers of the laser parameters by a bisection method according to the optimum parameter number combination; and repeating the previous step until space between the intermediate value and the upper limit value and the lower limit value within the range of the candidate numbers of the laser parameters accords with the minimum settable resolution ratio of the laser parameters. In addition, a method for adjusting a plurality of laser parameters of pulse laser and a laser machining machine for adjusting the parameters automatically are also provided.

Description

technical field [0001] The invention relates to a parameter adjustment method, in particular to a laser process parameter adjustment method. Background technique [0002] The laser scribing process is widely used in the scribing and cutting of solar cells, silicon wafers, semiconductor materials and ceramic materials. The advantage of replacing the traditional wheel cutting with laser scribing is that it only needs to cut the surface, omitting the need for edging and cleaning after cutting with the wheel, and improving the shortcoming of cutting with a wheel that is prone to debris. However, it may cause the cut surface to be scorched black or the surface to be crushed by pressure and the molten material to be extruded into a ridge-like protrusion (Hillock). Therefore, the choice of laser parameters is an important key to provide good cut surface quality. [0003] The mechanism of laser equipment is complex, so there are many parameters in its manufacturing process, such a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/00B23K26/36B23K26/42G05B19/414B23K26/38B23K26/70
CPCY02P70/10
Inventor 李俊豪
Owner 李俊豪