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Hardenable siloxane resin composition for light emitting diode element

A technology of curable siloxane and resin composition, applied in electrical components, semiconductor devices, circuits, etc., can solve problems such as cracking, hardening, and easy deterioration, and achieve excellent thermal shock resistance due to temperature difference

Active Publication Date: 2012-05-23
DAXIN MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Silicone-based materials are generally used to form cross-linked silicone-based resin compositions, and have properties such as weather resistance, heat resistance, crack resistance, elongation, hardness, etc., and can be used in various applications, such as In recent years, polysiloxane-based compositions have been used as encapsulation materials, especially for encapsulating LED components, but the known polysiloxane encapsulant formulations are prone to deterioration, hardening and cracking in high-temperature and high-humidity environments. Glue and other issues

Method used

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  • Hardenable siloxane resin composition for light emitting diode element
  • Hardenable siloxane resin composition for light emitting diode element
  • Hardenable siloxane resin composition for light emitting diode element

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0118] Take 2.88 grams of polysiloxane (1) and 2.7 grams of polysiloxane (4), and mix them uniformly at 90°C to form a mixture; after that, lower the temperature to room temperature, and then add 1.45 grams of polysiloxane ( Six), to obtain a reaction mixture; add 0.036 gram of Pt / 1-octanol solution (concentration is 5000ppm) in this reaction mixture as the catalyst of addition reaction, and add 0.2 gram of polysiloxane (7), through fully After mixing, vacuum defoaming is carried out to obtain the encapsulant formula.

Embodiment 2 to 6

[0120] The composition weight (grams) of the formula shown in Table 1, respectively take alkenyl-containing high cross-linking degree network polysiloxane and alkenyl-containing low cross-linking network polysiloxane, mix at 90 ° C Uniformly, to form a mixture; After that, the temperature is lowered to room temperature, and polysiloxane (6) is added to obtain a reaction mixture; 0.036 gram of Pt / 1-octanol solution (concentration of 5000ppm) and 0.2 gram of polysiloxane (7), and vacuum defoaming after thorough mixing, to prepare the encapsulation formulations of Examples 2 to 6.

[0121] The encapsulation glue formulations prepared in the above-mentioned Examples 1 to 6 were made into sheet test samples, and the hardness, light penetration, red ink test, reflow test, high temperature and high temperature were carried out on each sample according to the above-mentioned characteristic evaluation method Table 1 shows the evaluation results of the hot and cold cycle test (0°C / 260°C...

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Abstract

The invention discloses a hardenable siloxane resin composition which contains alkenyl-containing netty polysiloxane (A) with high crosslinking degree, alkenyl-containing netty polysiloxane (B) with low crosslinking degree, silicon-hydrogen-bond-containing polysiloxane (C) and a catalyst (D) for hydrosilylation reaction and optionally contains silicon-hydrogen-bond-containing polysiloxane (E) with an epoxy group. The hardenable siloxane resin composition provided by the invention is suitable for a packaging gum formula of an LED (Light Emitting Diode) device and has excellent temperature-difference thermal impact performance, gum crack resistance and stability.

Description

technical field [0001] The present invention relates to a curable silicone resin composition, in particular to an encapsulant formula for applying the curable silicone resin composition to LED elements, and also to a curable silicone resin composition containing the curable silicone resin composition. Hardened silicone resin composition as an encapsulant formulation for LED components. Background technique [0002] In the known technology, U.S. Patent US 7,615,387B2 (announced on November 10, 2009) discloses a silicone composition with crack resistance and addition reaction hardening, and U.S. Patent US 7,705,104B2 (announced on April 27, 2010 Announcement) discloses an addition reaction curable siloxane resin composition, and these siloxane (resin) compositions can be used as encapsulant materials for LEDs. The siloxane composition disclosed in the above-mentioned U.S. patent includes: network vinylpolysiloxane (network vinylpolysiloxane), which has a straight chain segmen...

Claims

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Application Information

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IPC IPC(8): C08L83/07C08L83/05H01L33/56
Inventor 钟显政廖元利翁伟翔张誉珑李昌鸿谢育材
Owner DAXIN MATERIALS
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