Method of producing electrically conducting via in substrate
A technology in conductive vias and substrates, which is applied in the field of making conductive vias, and can solve problems such as easy errors and difficulty in implementing electroplating processes.
Inactive Publication Date: 2012-05-23
PICODRILL
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Problems solved by technology
[0003] However, this technique is also prone to error and, especially for small holes generated with a laser, is difficult for such small diameter holes because of the need to deposit an initial germination layer that allows subsequent metallization. Difficult to achieve electroplating process
Method used
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Embodiment Construction
[0054] Furthermore, with reference to the accompanying drawings, the following are shown:
[0055] figure 1 (A) shows a schematic diagram for an embodiment of forming a conductive via (6) in an electrically insulating substrate material (1) such as epoxy or glass fiber reinforced epoxy. The substrate is placed between two electrodes (3, 3') connected to a user-controlled and optionally process-controlled voltage source (4). Dissipation within the substrate is triggered when a voltage is applied between the electrodes and lowers the breakdown voltage of the substrate. The reduction of the breakdown voltage is achieved by introducing heat (eg by means of laser irradiation (5)) or by introducing distortion (eg touching / pressing the electrodes to the substrate to create a better discharge path). The duration of energy dissipation and the characteristics of the voltage source determine the extent of the region in which energy is dissipated. Energy dissipation leads to a ch...
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Abstract
The present invention relates to a method of producing an electrically- conducting via in a substrate and to a substrate produced thereby. The method comprises the steps : a) providing a substrate made of at least one electrically insulating material (1), b) placing said substrate between two electrodes (3, 3' ), said two electrodes being connected to a user-controlled voltage source (4), c) appling a voltage to said substrate, d) causing a dielectric breakdown and energy dissipation between said two electrodes through said substrate by locally or globally increasing the electrical conductivity of said substrate, wherein, in step d), a modification of said at least one electrically insulating material into an electrically conducting material occurs, thereby generating an electrically conducting via (6). In particular, in one embodiment, the present invention relates to a substrate, such as a printed circuit board having one or several metal-free electrically conducting vias.
Description
technical field [0001] The present invention relates to a method of making a conductive via in a substrate and a substrate made thereby. Specifically, in one embodiment, the present invention relates to a substrate, such as a printed circuit board (PCB), having one or more metal-free conductive vias. Background technique [0002] Printed circuit boards (PCBs) are used to support and electrically connect electronic components using conductive paths etched from metal sheets, such as copper sheets, laminated to a non-conductive substrate. Often through contacts must be made through these circuit boards in order to make electrical contact from one side of the board to the other. Traditionally, this has been accomplished in the past by embedding metal pegs or pins into the board. However, this method is limited in its resolution. Alternatively, a tungsten carbide drill bit can be used to drill the through-holes, and the holes thus created are subsequently plated. In terms of ...
Claims
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IPC IPC(8): H05K3/10H05K3/40H05K3/00
CPCH05K3/0032H05K3/4038H05K2203/1115H05K3/105B26F1/28H05K3/0017H05K2203/1136H05K3/0035H05K2201/0323H05K2203/105Y10T29/49165H05K3/40H05K3/10
Inventor 莱安德·迪特曼
Owner PICODRILL