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Demoulding material for resin matrix substrate and method for producing the same

A technology for release materials and manufacturing methods, applied in the direction of epoxy resin coatings, chemical instruments and methods, synthetic resin layered products, etc., can solve problems such as peeling off and difficult mirror panels, and achieve easy peeling, increased productivity, and static electricity generation little effect

Inactive Publication Date: 2012-05-30
SUN ALUMINUM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the above-mentioned production, the mirror plate and the prepreg (resin-based printed circuit board) are bonded by heat and pressure, and when the laminate is disassembled, there is a problem that the mirror plate is difficult to peel off from the manufactured resin-based printed circuit board.

Method used

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  • Demoulding material for resin matrix substrate and method for producing the same
  • Demoulding material for resin matrix substrate and method for producing the same
  • Demoulding material for resin matrix substrate and method for producing the same

Examples

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Effect test

Embodiment

[0112] The resin paint shown in Table 1 was applied to one side of an aluminum foil (1000 series alloy, proof stress: 140 MPa) having a thickness of 20 μm by a bar coater to form a resin coating film. Then, a sintering process was performed under the conditions shown in this Table 1, and the mold release material was produced.

[0113] For the prepared release materials (No. 1 to 16), a release test was performed in the following procedure to measure the adhesive strength of the resin coating film (release material) to the printed circuit board and evaluate the release properties of the release material. The results are shown in Table 1.

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Abstract

The invention provides a demoulding material for resin matrix substrate and a method for making the same. When used for manufacturing the resin matrix substrate, the demoulding material is easier to be peeled off from the resin matrix substrate and has excellent stripping performance. The demoulding material for resin matrix substrate of the invention is used for producing the resin matrix substrate. The demoulding material is characterized in that: the demoulding material (1A) comprises an aluminium foil (2) and a resin film (3), with the resin film (3) formed upon one surface or double surfaces of the aluminum foil and composed of an epoxy series resin, a melamine series resin, and a silicone. The bonding strength of the resin film (3) to the resin matrix substrate is 1 to 200g / cm.

Description

technical field [0001] The present invention relates to a release material for a resin-based substrate used when manufacturing a resin-based substrate and a method for producing the same. Background technique [0002] As one of the resin-based substrates, there is a resin-based printed circuit board, and its manufacture is performed as follows. First, glass cloth, paper, etc. are impregnated with a resin, and then dried to form a semi-cured sheet (hereinafter referred to as a prepreg). The prepreg, the copper foil, and the mirror plate made of stainless steel were laminated, and a plurality of laminates thus obtained were stacked, and hot plates were placed above and below the laminates, and pressure was applied. Next, the hot plate and the mirror plate are removed, and the laminate is disassembled to manufacture a resin-based printed circuit board composed of a prepreg after the resin has been cured and a copper foil bonded to the surface. It should be noted that at this ...

Claims

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Application Information

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IPC IPC(8): B32B15/092B32B27/18C09D163/00
CPCB05D5/02B05D7/14B05D7/24B05D2202/25C09D1/00
Inventor 佐藤直干冈村康弘
Owner SUN ALUMINUM CORP
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