Demoulding material for resin matrix substrate and method for producing the same
A technology for release materials and manufacturing methods, applied in the direction of epoxy resin coatings, chemical instruments and methods, synthetic resin layered products, etc., can solve problems such as peeling off and difficult mirror panels, and achieve easy peeling, increased productivity, and static electricity generation little effect
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[0111] Example
[0112] The resin paint shown in Table 1 was coated on one side of an aluminum foil (1000 series alloy, elastic limit stress: 140 MPa) with a thickness of 20 μm using a bar coater to form a resin coating film. Then, the sintering process was performed under the conditions shown in Table 1 to produce a mold release material.
[0113] With respect to the produced mold release materials (No. 1 to 16), a releasability test was performed according to the following procedure, the adhesive strength of the resin coating film (release material) to the printed circuit board was measured, and the releasability of the mold release material was evaluated. The results are shown in Table 1.
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