Preparation method of ruthenium metal sputtering target material
A metal sputtering and target technology, used in metal material coating process, sputtering coating, ion implantation coating and other directions, can solve the problem of poor control of grain uniformity, inability to prepare targets with net size, and operating costs High problems, to achieve the effect of shortening preparation time, short preparation cycle and low equipment price
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[0028] 1. Mix 3N5 high-purity ruthenium powder, put the powder into a high-purity graphite mold, and then perform a direct hot pressing process.
[0029] 2. The heating process is divided into two stages: the first stage is from room temperature to 1200°C, and the heating rate is 50°C·min -1 , keep warm for 10 minutes after reaching 1000°C; the second stage is from 1200°C to hot pressing temperature, and start to pressurize as the temperature rises, and the heating rate is 25°C·min -1 .
[0030] 3. After the temperature rises to the target temperature, the pressure will reach 35MPa, and then heat preservation and pressure preservation will start. The temperature at this stage is 1500-1650℃, and the heat preservation and pressure preservation time is 10-60min.
[0031] 4. The cooling speed should be controlled during the cooling process, and the cooling time should not be less than 30 minutes.
[0032] 5. After the hot pressing process, the target blank is machined and ground...
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